Copper‐oxide compound semiconductors provide a unique possibility to tune the optical and electronic properties from insulating to metallic conduction, from bandgap energies of 2.1 eV to the infrared at 1.40 eV, i.e., right into the middle of the efficiency maximum for solar‐cell applications. Three distinctly different phases, Cu2O, Cu4O3, and CuO, of this binary semiconductor can be prepared by thin‐film deposition techniques, which differ in the oxidation state of copper. Their material properties as far as they are known by experiment or predicted by theory are reviewed. They are supplemented by new experimental results from thin‐film growth and characterization, both will be critically discussed and summarized. With respect to devices the focus is on solar‐cell performances based on Cu2O. It is demonstrated by photoelectron spectroscopy (XPS) that the heterojunction system p‐Cu2O/n‐AlGaN is much more promising for the application as efficient solar cells than that of p‐Cu2O/n‐ZnO heterojunction devices that have been favored up to now.
Phase separation and thermal crystallization of SiO/SiO2 superlattices results in ordered arranged silicon nanocrystals. The preparation method which is fully compatible with Si technologies enables independent control of particle size as well as of particle density and spatial position by using a constant stoichiometry of the layers. Transmission electron microscopy investigations confirm the size control in samples with an upper limit of the nanocrystal sizes of 3.8, 2.5, and 2.0 nm without decreasing the silicon nanocrystal density for smaller sizes. The nanocrystals show a strong luminescence intensity in the visible and near-infrared region. A size-dependent blueshift of the luminescence and a luminescence intensity comparable to porous Si are observed. Nearly size independent luminescence intensity without bleaching effects gives an indirect proof of the accomplishment of the independent control of crystal size and number.
We present a simple method for the elimination of cracks in GaN layers grown on Si (111). Cracking of GaN on Si usually occurs due to large lattice and thermal mismatch of GaN and Si when layer thicknesses exceeds approximately 1 µm. By introducing thin, low-temperature AlN interlayers, we could significantly reduce the crack density of the GaN layer. The crack density is practically reduced to zero from an original crack density of 240 mm-2 corresponding to crack-free regions of 3×10-3 mm2. Additionally for the GaN layer with low temperature interlayers, the full width at half maximum X-ray (2024) rocking curve is improved from approximately 270 to 65 arcsec.
We report on GaN n-type doping using silane, germane, and isobutylgermane as Si and Ge dopants, respectively. A significant increase in tensile stress during growth is observed for Si doped samples while this is not the case for Ge doping. In addition, Ge can be doped up to 2.9 Â 10 20 cm À3 , while Si doping leads to 3-D growth already at concentrations around 1.9 Â 10 19 cm À3. The free carrier concentration was determined by Hall-effect measurements, crystal quality, and structural properties by x-ray diffraction measurements. Additionally, secondary ion mass spectroscopy and Raman measurements were performed demonstrating the high material quality of Ge doped samples. V
Photoluminescence properties and crystallization of silicon quantum dots in hydrogenated amorphous Si-rich silicon carbide filmsAnnealing of amorphous Si/SiO 2 superlattices produces Si nanocrystals. The crystallization has been studied by transmission electron microscopy and x-ray analysis. For a Si layer thinner than 7 nm, nearly perfect nanocrystals are found. For thicker layers, growth faults and dislocations exist. Decreasing the a-Si layer thickness increases the inhomogeneous strain by one order of magnitude. The origin of the strain in the crystallized structure is discussed. The crystallization temperature increases rapidly with decreasing a-Si layer thickness. An empirical model that takes into account the Si layer thickness, the Si/SiO 2 interface range, and a material specific constant has been developed.
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