FSI Simulation of Wire Sweep PBGA Encapsulation Process Considering Rheology Effect

Ramdan, Dadan; Abdullah, M. Z.; Mujeebu, M. Abdul; Loh, Wei Keat; Ooi, C. K.; Ooi, Renn Chan

doi:10.1109/tcpmt.2011.2171513

Cited by 19 publications

(6 citation statements)

References 26 publications

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“…However, the ability of FVM software (FLUENT) on fluid flow analysis was proven to be excellent in previous study [14][15][16]. Figure 3 shows the comparison of experimental and simulation result for mould filling versus time in the encapsulation process of TQFP [14] package respectively.…”

Section: Resultsmentioning

confidence: 94%

Effect of stacking chips and fluid/structure interaction simulation in 3D stacked flip-chip encapsulation process

Wong

Khor

Ernest

et al. 2012

2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

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In current study, simulation analysis was conducted to investigate the fluid/structure interaction (FSI) phenomenon in two, three, and four stacking chips package with through silicon via (TSV) during encapsulation process. In actual packaging, the visualization of FSI phenomenon is very hard due to the package size limitation, low availability of suitable equipment, and high experimental setup cost. Thus, modeling software such as FLUENT and ABAQUS were used to predict the fluid flow and structural deformation during the encapsulation process. Imitated package with scaled dimension were modeled using both finite volume and finite element code, coupled with MPCCI to perform the FSI analysis. The effects of increase in stacking chips number were investigated. All the three cases showed a similar mould filling rate using the designed inlet and outlet dimension. Moreover, void formation was also successfully reduced. Maximum von Mises stress and maximum displacement on perimeter of silicon chips and structure of TSV and solder bump were also determined. Larger chip displacement was observed at the edge compared to the corner of the chip. For two and four stacked chips package, the largest displacement of TSV and solder bumps structure occurred at the highest point of the structure while largest displacement occurred at the interface between the highest chip and its subsequent chip for three stacked chip package. The simulation model enhanced the understanding of FSI for stacked chip package during encapsulation process by providing better visualization and realistic prediction.

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Section: Resultsmentioning

confidence: 94%

Effect of stacking chips and fluid/structure interaction simulation in 3D stacked flip-chip encapsulation process

Wong

Khor

Ernest

et al. 2012

2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

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“…Therefore, the fundamental understanding of the FSI during molded packaging is important for the engineers and package designers. The fluid/structure interaction (FSI) phenomenon was also extensively reported in the encapsulation [1] [2].…”

Section: Introductionmentioning

confidence: 88%

A novel method to predict fluid/structure interaction in IC packaging

Hsu

Wang²,

Chen³

et al. 2014

2014 IEEE 64th Electronic Components and Technology Conference (ECTC)

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This paper reports a perspective investigation of computational modeling of fluid-structure interaction (FSI) in molded integrated-circuit(IC) packaging. The investigation is carried out through two aspects, respectively on interaction between the fluid and structure in the encapsulation process and appropriate methodology for modeling. We present a novel and integrated method to predict the FSI during the encapsulation process. This method not only provides more accurate melt front and pressure result but also predict precisely the FSI behavior through the dynamic mesh deformation technique simultaneously in accordance with continually deformed geometry (two way FSI). This is different from previous study that only one way considered fixed geometry (one way FSI) during encapsulation. Moreover, the experimental data for single-and stacked-chip were compared with the simulation results for two way FSI implementation to verify flow front advancement. From a real paddle shift case study, the result indicates that the deflection prediction is well predicted and could predict void formation well when it considers two way FSI effect. It is expected that this paper could clarify relevant issues in prediction of FSI in IC packaging and induce more considerations for modeling FSI using two way FSI multiphase flow method.

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“…Moreover, it can minimize the cost of long-term research activity. Simulation modeling has several applications in electronic packaging, such as integrated circuit (IC) encapsulation [1], fluid-structure interaction (FSI) in molded underfill [2], wire sweep analysis [3], thermal coupling method on ball grid array package reflow soldering [4], and flexible printed circuit board (PCB) [5].…”

Section: Introductionmentioning

confidence: 99%

“…The two-way coupling simulation method was employed by Yang et al [17] to predict wire sweep in encapsulation. In recent years, realtime FSI and thermal-coupling methods have been employed to model FSI and thermal-structural phenomena in wire deformation [18], molded underfill [19], reflow soldering [20], and mechanical aspects of flexible PCB [21]. Researchers used the MpCCI coupling method to integrate FLUENT and ABAQUS.…”

Section: Introductionmentioning

confidence: 99%

Thermal Fluid-Structure Interaction in the Effects of Pin-Through-Hole Diameter during Wave Soldering

Aziz

Abdullah

Khor

et al. 2014

Advances in Mechanical Engineering

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An effective simulation approach is introduced in this paper to study the thermal fluid-structure interaction (thermal FSI) on the effect of pin-through-hole (PTH) diameter on the wave soldering zone. A 3D single PTH connector and a printed circuit board model were constructed to investigate the capillary flow behavior when passing through molten solder (63SnPb37). In the analysis, the fluid solver FLUENT was used to solve and track the molten solder advancement using the volume of fluid technique. The structural solver ABAQUS was used to examine the von Mises stress and displacement of the PTH connector in the wave soldering process. Both solvers were coupled by MpCCI software. The effects of six different diameter ratios (0.1 < / < 0.97) were studied through a simulation modeling. The use of ratio / = 0.2 yielded a balanced filling profile and low thermal stress. Results revealed that filling level, temperature, and displacement exhibited polynomial behavior to / . Stress of pin varied quadratically with the / . The predicted molten solder profile was validated by experimental results. The simulation results are expected to provide better visualization and understanding of the wave soldering process by considering the aspects of thermal FSI.

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FSI Simulation of Wire Sweep PBGA Encapsulation Process Considering Rheology Effect

Cited by 19 publications

References 26 publications

Effect of stacking chips and fluid/structure interaction simulation in 3D stacked flip-chip encapsulation process

Effect of stacking chips and fluid/structure interaction simulation in 3D stacked flip-chip encapsulation process

A novel method to predict fluid/structure interaction in IC packaging

Thermal Fluid-Structure Interaction in the Effects of Pin-Through-Hole Diameter during Wave Soldering

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