Abstract:This paper reports a perspective investigation of computational modeling of fluid-structure interaction (FSI) in molded integrated-circuit(IC) packaging. The investigation is carried out through two aspects, respectively on interaction between the fluid and structure in the encapsulation process and appropriate methodology for modeling. We present a novel and integrated method to predict the FSI during the encapsulation process. This method not only provides more accurate melt front and pressure result but als… Show more
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