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The purpose of this study is to examine the effect of mental abacus training for children on their working memory. Suppression tasks were manipulated to investigate the roles played by visuo-spatial sketchpad and phonological loop for working memory of the primary task in tree experiments. The results showed that children who had received mental abacus training exhibited better performance on digit span but not Chinese word span than the ones without mental abacus training. The results also indicated that the mental arithmetic should depend on phonological loop to maintain and store numerical information for the children who had not received mental abacus training. Based on the results, children who had received mental abacus training have better performance in mental calculation than the ones without training. The author speculated that these children may execute mental calculation with their visuo-spatial sketchpad to form mental imagery.

This paper reports a perspective investigation of computational modeling of fluid-structure interaction (FSI) in molded integrated-circuit(IC) packaging. The investigation is carried out through two aspects, respectively on interaction between the fluid and structure in the encapsulation process and appropriate methodology for modeling. We present a novel and integrated method to predict the FSI during the encapsulation process. This method not only provides more accurate melt front and pressure result but also predict precisely the FSI behavior through the dynamic mesh deformation technique simultaneously in accordance with continually deformed geometry (two way FSI). This is different from previous study that only one way considered fixed geometry (one way FSI) during encapsulation. Moreover, the experimental data for single-and stacked-chip were compared with the simulation results for two way FSI implementation to verify flow front advancement. From a real paddle shift case study, the result indicates that the deflection prediction is well predicted and could predict void formation well when it considers two way FSI effect. It is expected that this paper could clarify relevant issues in prediction of FSI in IC packaging and induce more considerations for modeling FSI using two way FSI multiphase flow method.