Abstract:In current study, simulation analysis was conducted to investigate the fluid/structure interaction (FSI) phenomenon in two, three, and four stacking chips package with through silicon via (TSV) during encapsulation process. In actual packaging, the visualization of FSI phenomenon is very hard due to the package size limitation, low availability of suitable equipment, and high experimental setup cost. Thus, modeling software such as FLUENT and ABAQUS were used to predict the fluid flow and structural deformatio… Show more
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