Thermal Fluid-Structure Interaction in the Effects of Pin-Through-Hole Diameter during Wave Soldering

Abstract

An effective simulation approach is introduced in this paper to study the thermal fluid-structure interaction (thermal FSI) on the effect of pin-through-hole (PTH) diameter on the wave soldering zone. A 3D single PTH connector and a printed circuit board model were constructed to investigate the capillary flow behavior when passing through molten solder (63SnPb37). In the analysis, the fluid solver FLUENT was used to solve and track the molten solder advancement using the volume of fluid technique. The structural solver ABAQUS was used to examine the von Mises stress and displacement of the PTH connector in the wave soldering process. Both solvers were coupled by MpCCI software. The effects of six different diameter ratios (0.1 < / < 0.97) were studied through a simulation modeling. The use of ratio / = 0.2 yielded a balanced filling profile and low thermal stress. Results revealed that filling level, temperature, and displacement exhibited polynomial behavior to / . Stress of pin varied quadratically with the / . The predicted molten solder profile was validated by experimental results. The simulation results are expected to provide better visualization and understanding of the wave soldering process by considering the aspects of thermal FSI.

Thermal fluid-structure interaction of PCB configurations during the wave soldering process

“…To the best of the authors' knowledge, no study has reported on the influence of PCB configurations during the wave soldering process by using the coupling technique. Therefore, the present study extends the authors' work (Abdul Aziz et al, 2014a) and aims to investigate the influence of different PCB (sound card) configurations on temperature distribution, heat transfer coefficient, thermally induced displacement and stress. The understandings of these aspects are important to the designer prior to designing the sound card.…”

Optimization of pin through hole connector in thermal fluid–structure interaction analysis of wave soldering process using response surface methodology

“…The ability of this simulation technique to handle FSI problems had been proven in the author's recent studies [14,15,17]. The simulation predictions were validated by the experimental measurements.…”

“…4 illustrates the comparison of the experimental and simulation solder profile. Moreover, the simulation results had been validated in term of temperature [30], filling profile [14,15] and filling level [17]. Thus, this simulation technique is expected to provide the best visualization for the present study.…”

“…Therefore, the independent variables (i.e., offset position, diameter, offset angle, and solder temperature) were chosen in this study to investigate the interactive relationship of each factor by using RSM. The virtual modeling technique was applied to model the wave soldering process by using fluid (FLUENT) and structural (ABAQUS) solvers [17,18]. Filling time, thermal induced stress, and pin displacement were the responses in RSM optimization during the wave soldering process.…”

“…Pract. Theory (2015), http://dx.doi.org/10.1016/ j.simpat.2015.Validation of predicted and experimental results[17].…”