2001
DOI: 10.1016/s0026-2714(01)00049-x
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FeRAM technology for high density applications

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Cited by 145 publications
(83 citation statements)
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“…The properties of two wellknown perovskite ferroelectrics, Lead Zirconate Titanate (PZT) and Strontium Barium Titanate (SBT), is compared with Si:HfO 2 in Table 1. The recently discovered ferroelectric thin film, Si:HfO 2 [28,6], has a relatively high coercive field that ensures a large memory window [29][30][31][32][33][34][35][36][37][38][39].…”
Section: Ferroelectric Materialsmentioning
confidence: 99%
See 1 more Smart Citation
“…The properties of two wellknown perovskite ferroelectrics, Lead Zirconate Titanate (PZT) and Strontium Barium Titanate (SBT), is compared with Si:HfO 2 in Table 1. The recently discovered ferroelectric thin film, Si:HfO 2 [28,6], has a relatively high coercive field that ensures a large memory window [29][30][31][32][33][34][35][36][37][38][39].…”
Section: Ferroelectric Materialsmentioning
confidence: 99%
“…Due to the large number of defects, leakage current, and large lattice mismatch between perovskite ferroelectrics and silicon, it is always necessary to use a buffer layer with a proper interface Table 1 The ferroelectric properties of PZT [29][30][31][32], SBT [33][34][35][36][37][38][39], and Si:HfO 2 [28]. with the substrate.…”
Section: Buffer Layermentioning
confidence: 99%
“…However, when the bias is removed, the polarization disappears, unless ferroelectric materials are used. Ferroelectric materials show a remanent polarization after removal of the electric field [143]. The direction (up or down) of the remanent polarization can be exploited to make a memory bit.…”
Section: Ferroelectric Memoriesmentioning
confidence: 99%
“…Perovskite insulators have attracted particular attention for applications such as ferroelectric random access memories (FeRAM), 1 dynamic RAM, 2 and alternative gate materials for metal oxide semiconductor field effect transistors (MOSFETs). 3 A recent review details their short-term and future prospects for the nanoelectronics industry, further proof of the need to integrate this promising material in next generation devices.…”
Section: Introductionmentioning
confidence: 99%