Fan-in WLP: Technology and Market Trends

The semiconductor industry, for more than five decades, has followed Moore's law and was driven by miniaturization of the transistors, scaling the CMOS technology to smaller and more advanced technology nodes while, at the same time, reducing the cost. The industry is reaching now limitations in continuing this scaling process in cost effective way. While technology nodes continue to be developed and innovative solutions are being proposed, the investment required to bring such technologies to production are significantly increasing. To overcome these limitations, new packaging technologies have been developed, enabling integration of more performing as well as various type of devices within the same package. This paper will provide an overview of current trends seen in the industry across all the packaging platforms (WLCSP1, FanOut2, Embedded Die2, Flip Chip3 and 3DIC4). Challenges, applications, positioning of the different packaging technologies by market segments (from low end to high end applications) and changes of the markets and drivers, growth rates and roadmaps will be presented. Global capacities and demands and the landscape of the packaging industry will be reviewed. Examples of teardowns to illustrate the latest packaging techniques for various devices used in latest products will be included.

show abstract

The Growth of Advanced Packaging: An Overview of the Latest Technology Developments, Applications and Market Trends

Beica

Ivankovic

Buisson

et al. 2015

International Symposium on Microelectronics

Self Cite

View full text Add to dashboard Cite

show abstract

2.5D Interposers and Advanced Organic Substrates Landscape: Technology and Market Trends

Ivankovic

Buisson

Kumar

et al. 2015

International Symposium on Microelectronics

View full text Add to dashboard Cite

This work focuses on the analysis of recent developments and future trends of organic substrates and 2.5D interposers. In the sub 10 μm line/width space, substrate manufacturers are pushing towards traditionally foundry level Si processing dimensions. Latest R&D shows organic substrates with L/S capability down to 2/2 μm. Organic substrates and 2.5D interposers can be in many cases separated in two different groups, however certain solutions propose a combination of the two, such as embedded interposers or fine extension layers of organic substrates acting as interposers. These substrate and interposer architectural solutions are analyzed. Furthermore, organic processing options and latest feature sizes are discussed. Dielectric build up material options with low dielectric constant (Dk) and low tangent loss (Df) are analyzed and their expected thermo-mechanical property trends presented, including the coefficient of thermal expansion (CTE), Young's modulus (E) and glass transition temperature (Tg). Coreless substrates and their advantages, disadvantages, industry readiness and future development are also addressed. Furthermore, 2.5D interposer options are analyzed by type of material: Si, glass and organic. A qualitative and quantitative comparison of their features and market status is done and their future development is extrapolated. Final conclusions are made on the sub 10 μm line/width advanced substrate application space and the market interaction of organic substrates and 2.5D interposers

show abstract

Fan-in WLP: Technology and Market Trends

Ivankovic

Buisson

Kumar

et al. 2015

International Symposium on Microelectronics

View full text Add to dashboard Cite

The semiconductor industry is facing a new era in which device scaling and cost reduction will not continue on the path they followed for the past few decades, with Moore's law in its foundation. Advanced nodes do not bring the desired cost benefit anymore and R&D expenses for new lithography solutions and devices in sub-10nm nodes are rising substantially. Subsequently, new market shifts are expected in due time, with “Internet of Things” (IoT) getting ready to take over pole market driver position from mobile. In these circumstances, where front-end-of-line (FEOL) scaling options remain uncertain and IoT promises application diversification, in order to answer market demands, the industry seeks further performance and functionality boosts in package level integration. Emerging packages such as fan-out wafer level packages, 2.5D/3D IC and related System-in-Package (SiP) solutions together with more conventional but upgraded flip chip BGAs aim to bridge the gap and revive the cost/performance curve. In such an environment, what is the importance of fan-in wafer level packages (FI WLP), the current status of the fan-in WLP industry and how will fan-in WLP market and technology evolve? This work aims to answer these questions by performing an in-depth analysis on fan-in WLP market dynamics and technology trends.

show abstract

scite is a Brooklyn-based organization that helps researchers better discover and understand research articles through Smart Citations–citations that display the context of the citation and describe whether the article provides supporting or contrasting evidence. scite is used by students and researchers from around the world and is funded in part by the National Science Foundation and the National Institute on Drug Abuse of the National Institutes of Health.

Contact Info

hi@scite.ai

10624 S. Eastern Ave., Ste. A-614

Henderson, NV 89052, USA

Blog Terms and Conditions API Terms Privacy Policy Contact Cookie Preferences Do Not Sell or Share My Personal Information

Made with 💙 for researchers

Part of the Research Solutions Family.

Fan-in WLP: Technology and Market Trends

Cited by 4 publications

References 1 publication

The Growth of Advanced Packaging: An Overview of the Latest Technology Developments, Applications and Market Trends

The Growth of Advanced Packaging: An Overview of the Latest Technology Developments, Applications and Market Trends

2.5D Interposers and Advanced Organic Substrates Landscape: Technology and Market Trends

Fan-in WLP: Technology and Market Trends

Contact Info

Product

Resources

About