Epoxy resin/hollow glass microspheres composite materials with low dielectric constant and excellent mechanical performance

Abstract

The materials with low dielectric constant and low dielectric loss are vital for high integration degree of the circuit board. Although many polymers like epoxy resin exhibit excellent comprehensive performance, their dielectric constant is unable to satisfy high electronic packaging application. In this work, we present a simple grafting strategy via reaction between the hollow glass microsphere and polyhedral oligomeric silsesquioxane followed by blending epoxy resin to fabricate epoxy resin hollow glass microspheres composite materials. The superior heat resistance of hollow glass microspheres (HGM) can improve the thermal performance of composites. Due to the addition of Ge‐POSS, P‐HGM exhibited a good interfacial compatibility with epoxy resin matrix and forms an interfacial adhesion region. With the P‐HGM loading of 20 wt%, the fabricated composite materials exhibited the low dielectric constant of 2.59 and low dielectric loss of 0.0145. At the same time, the tensile strength, impact strength and flexural strength were 42.15 MPa, 24.33 kJ/m2 and 90.82 MPa, respectively, which demonstrated that the epoxy resin hollow glass microspheres composite materials processed superb mechanical behavior. It suggests that this method is a promising potential for fabricating low dielectric composite materials.

Processing of Low-Density HGM-Filled Epoxy–Syntactic Foam Composites with High Specific Properties for Marine Applications

“…It was observed that higher density HGMs remained intact in the PPMA matrix and increasing HGM density resulted in a reduction in mechanical properties. SFC as a form of polymeric composite materials (PCMs) typically possess numerous properties, such as low density, good thermal insulation, low coefficient of thermal expansion, high strength-to-weight ratio, good acoustic properties, low moisture absorption and good resistance to hydrostatic pressure [ 12 , 13 , 14 , 15 , 16 ]. Most of these special properties are caused by various factors, such as filler sizes, type of binder used, volume fraction considered, void fraction, filler/matrix interface and condition of manufacturing, which yields unique applications [ 8 ].…”

Preparation and Properties of Hollow Glass Microspheres/Dicyclopentadiene Phenol Epoxy Resin Composite Materials

“…M. Imran et al [ 36 , 37 ] utilized HGM to fill epoxy resins and achieved satisfactory mechanical performance. Zhang et al [ 38 ] prepared low dielectric constant composite materials containing epoxy resin and HGM through the encapsulation of KH550 and grafting POSS. The experimental results demonstrated that the composite material exhibited an extremely low dielectric constant of 2.59 and a dielectric loss of 0.0145 when the filler content was at 20 weight percent.…”

Study on the foaming behavior of density‐controllable epoxy resin composite foam under negative pressure environment

“…At present, the preparation methods of thermosetting ERCF are mainly focused on the chemical foaming method, physical foaming way, and hollow microsphere‐filled foaming strategy 7–11 . For example, Ma et al 12 prepared a new composite foaming agent by filling the cells of microporous silica with the chemical foaming agent 4,4′‐oxobenzenesulfonyl hydrazide (OBSH), which can be used as both filler and foaming agent, and the ERCF can be easily produced by the decomposition of the foaming agent.…”

“…[4][5][6] At present, the preparation methods of thermosetting ERCF are mainly focused on the chemical foaming method, physical foaming way, and hollow microspherefilled foaming strategy. [7][8][9][10][11] For example, Ma et al 12 prepared a new composite foaming agent by filling the cells of microporous silica with the chemical foaming agent 4,4 0oxobenzenesulfonyl hydrazide (OBSH), which can be used as both filler and foaming agent, and the ERCF can be easily produced by the decomposition of the foaming agent. The advantage of this method is that good-performance foam can be produced by simple process operations, 13,14 but the disadvantage is obvious, for example, lots of organic chemical foaming agents or their by-products are toxic, and the incomplete decomposition of foaming agent as well as its decomposition residues make negative effect on mechanical properties of the material, so the use of chemical foaming agent has become one of the main problems affecting the performance of ERCF.…”