Study on the foaming behavior of density‐controllable epoxy resin composite foam under negative pressure environment

Zhou, Ting; Jin, Bo; Liu, Wei; Yang, Le; Jiang, Tuanhui; Zeng, Xiangbu; Shi, Fa‐guo; Shen, Kunyu; Zhang, Chun; He, Li

doi:10.1002/pc.27527

Cited by 3 publications

(1 citation statement)

References 36 publications

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“…1 Their applications span across electronics encapsulation, 2 construction, 3 and automotive industries. 4,5 Recently, various techniques have been developed to prepare epoxy foams, such as chemical foaming, [6][7][8] physical foaming, 9,10 incorporation of hollow microspheres, 11,12 and mechanical stirring. 13,14 Among these approaches, the chemical foaming method has garnered significant attention because of its costeffectiveness and simplicity in preparation.…”

Section: Introductionmentioning

confidence: 99%

Computational modeling and simulation of temperature field evolution during the chemical foaming of epoxy foams

Ding,

Qi,

Chen

et al. 2024

Polymer Engineering & Sci

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The evolution and control of the temperature field during the chemical foaming of epoxy resin are of paramount importance because the foam structure results from the competition of resin crosslinking and foaming, both of which are highly dependent on temperature distributions. Herein, the epoxy foams, consisting of diglycidyl ether of bisphenol A, glycidyl amine‐type epoxy resin, and 4,4′‐diamino diphenyl sulfone hardener, are prepared using azodicarbonamide and 4,4′‐oxydibenzenesulfonyl hydrazide as a chemical foaming agent (CFA). Kinetic models for heat release and CFA decomposition are established using the auto‐catalytic and n‐th order models, respectively. By integrating the transient flow of resin during the foaming process, numerical simulations of the temperature field evolution within the self‐expanding geometry are conducted to investigate the effects of foaming temperature, heat transfer coefficient, and mold diameter on spatial temperature distributions. A comparison of the kinetic parameters of epoxy curing and CFA decomposition at various foaming temperatures (433, 443, and 453 K) reveals that the acceleration of the curing rate is consistent with that of the decomposition rate as the foaming temperature increases, then the foam structure remains largely unchanged across different foaming temperatures. However, local overheating is unavoidable for the foams at 443 and 453 K. This study offers a method for optimizing the processing parameters in preparing epoxy foams.Highlights Auto‐catalytic model for predicting heat released rate is well established. The decomposition kinetics of the chemical foaming agent is described by n‐th model. Nonisothermal simulation is implemented to study the self‐expanded process of epoxy foam. The foam structure is predicted by comparing the kinetic between the curing and expansion processes.

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Section: Introductionmentioning

confidence: 99%

Computational modeling and simulation of temperature field evolution during the chemical foaming of epoxy foams

Ding,

Qi,

Chen

et al. 2024

Polymer Engineering & Sci

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Microstructure and performances of rigid polyurethane foam prepared using double‐effect baking powder as a foaming agent

Cheng,

Zhang,

Liu

et al. 2024

Polymer Engineering & Sci

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The preparation of rigid polyurethane foam with uniform pore size is extremely challenging. In this work, double‐effect baking powder was used as foaming agent, and rigid polyurethane foam with regular morphology was successfully prepared through semi‐prepolymerization. The rigid polyurethane foam apertures with regular morphology were controlled by the secondary release of CO2 when the content of baking powder is 0.30 part. Combined with theoretical calculation and experimental test, it is found that the particle size distribution, wall thickness, and hole shape are uniform, regular, thin, polygonal, and few broken holes. The compression strength, contact angle, and surface energy of the rigid polyurethane foam are 33.36 kPa, 109.6°, and 21.8 mJ/m2 after adding 0.20 part of double‐effect baking powder, respectively. By adjusting the amount of double‐acting baking powder, the porosity, mechanical properties and foam rate of the polyurethane foams could be significantly improved. Due to the molecular solvation effect, rigid polyurethane foams will deform in the water and oil due phase, but it can remain stable for a long time at room temperature without solvent. It provides a new method for the preparation of rigid polyurethane foam, which is expected to be widely used in transportation and other fields.Highlights Baking powder was firstly used as a foaming modifier for rigid polyurethane. Baking powder releases CO2 twice to ensure uniform structure of polyurethane cell. Rigid polyurethane foam has long‐term stability and regular, uniform cell holes. The porosity and mechanical properties of foams could be significantly improved. Foaming mechanism of rigid polyurethane using baking powder was firstly revealed.

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Study on Foaming Behavior of Block Copolymer/Inorganic Particle Co-Construction of Toughened Epoxy Resin Foams

Zhang,

Zhou,

et al. 2024

Preprint

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Study on the foaming behavior of density‐controllable epoxy resin composite foam under negative pressure environment

Cited by 3 publications

References 36 publications

Computational modeling and simulation of temperature field evolution during the chemical foaming of epoxy foams

Computational modeling and simulation of temperature field evolution during the chemical foaming of epoxy foams

Microstructure and performances of rigid polyurethane foam prepared using double‐effect baking powder as a foaming agent

Study on Foaming Behavior of Block Copolymer/Inorganic Particle Co-Construction of Toughened Epoxy Resin Foams

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