Preparation and Properties of Hollow Glass Microspheres/Dicyclopentadiene Phenol Epoxy Resin Composite Materials

Abstract

With the development of the integrated circuit and chip industry, electronic products and their components are becoming increasingly miniaturized, high-frequency, and low-loss. These demand higher requirements for the dielectric properties and other aspects of epoxy resins to develop a novel epoxy resin system that meets the needs of current development. This paper employs ethyl phenylacetate cured dicyclopentadiene phenol (DCPD) epoxy resin as the matrix and incorporates KH550 coupling-agent-treated SiO2 hollow glass microspheres to produce composite materials with low dielectric, high heat resistance, and high modulus. These materials are applied as insulation films for high density interconnect (HDI) and substrate-like printed circuit board (SLP) boards. The Fourier transform infrared spectroscopy (FTIR) technique was used to characterize the reaction between the coupling agent and HGM, as well as the curing reaction between the epoxy resin and ethyl phenylacetate. The curing process of the DCPD epoxy resin system was determined using differential scanning calorimetry (DSC). The various properties of the composite material with different HGM contents were tested, and the mechanism of the impact of HGM on the properties of the composite material was discussed. The results indicate that the prepared epoxy resin composite material exhibits good comprehensive performance when the HGM content is 10 wt.%. The dielectric constant at 10 MHz is 2.39, with a dielectric loss of 0.018. The thermal conductivity is 0.1872 Wm−1 k−1, the coefficient of thermal expansion is 64.31 ppm/K, the glass transition temperature is 172 °C, and the elastic modulus is 1221.13 MPa.

Study on Thermomechanical Properties and Morphology of an Epoxy Resin Thermally Conductive Adhesive under Different Curing Conditions

“…The peak value of the loss factor corresponds to the glass transition temperature of the sample, , and the peak value is shown in Table With the increase of curing temperature and the extension of curing time, it moves in the direction of high temperature. This is because the more heat the curing provides, the higher the cross-linking degree of the epoxy molecules, and the lower the free molecular volume, the movement of the molecular chain is blocked, and the glass transition temperature increases. − …”

“…This is because the more heat the curing provides, the higher the cross-linking degree of the epoxy molecules, and the lower the free molecular volume, the movement of the molecular chain is blocked, and the glass transition temperature increases. 42 − 45 …”

Lightweight insulating oil-well cement filled with hollow glass microspheres and numerical simulation of its unsteady heat transfer process

“…The peak at 991 cm − 1 corresponds to the asymmetric stretching vibration of Si-O-this is the absorption peak of silica-oxygen bond formation in the silica-oxygen tetrahedral structure of the hydrated calcium silicate gel-con rming the presence of hydrated calcium silicate. [42][43][44][45] The FTIR results indicate that the hydration products of the HGM/OWC LWTI composites were mainly calcium silicate hydrate and Ca (OH) 2 .…”