1994
DOI: 10.1116/1.579219
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Brass-rubber adhesive interphase investigated via depth profiling by using Auger electron spectroscopy

Abstract: The adhesive interphase formed between brass and sulfur crosslinked rubber is known to be a complex layer of metal oxides, sulfides, and rubber. Hostile aging of this system produces changes in the structure, morphology, thickness, and mechanical properties of this layer. In this work it has been demonstrated that the overall thickness of the sulfide film can be used to characterize the degradation of the adhesive layer. The thickness of the sulfide film was measured from depth profiles of the brass-plated ste… Show more

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Cited by 18 publications
(2 citation statements)
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“…Thus, the resulting Cu x S and ZnO/ZnS layers may have poorer mechanical properties than the as-prepared sample. This could be a reason why the adhesion force was lower after the wet-heat aging treatment . The dezincification probably also removes zinc from the brass alloy, leaving a porous mass of copper that has poor mechanical strength.…”
Section: Resultsmentioning
confidence: 99%
“…Thus, the resulting Cu x S and ZnO/ZnS layers may have poorer mechanical properties than the as-prepared sample. This could be a reason why the adhesion force was lower after the wet-heat aging treatment . The dezincification probably also removes zinc from the brass alloy, leaving a porous mass of copper that has poor mechanical strength.…”
Section: Resultsmentioning
confidence: 99%
“…Thin layers are often depth profiled when we want to analyze the chemical composition and thickness of a single layer or a multilayer structure. In this way, corrosion properties, diffusion mechanisms, native or artificially prepared oxide layers, , layers that compose integrated circuits, and the composition of nanoparticles, nanolayers, and nanocomposite coatings, , paints, adhesives, catalysts, , thin polymer films, biological compounds , and even cells and tissues , can be studied. Such analyses can be performed using a variety of surface-sensitive analytical techniques such as SIMS (secondary ion mass spectrometry), XPS (X-ray photoelectron spectroscopy) or AES (Auger electron spectroscopy) in combination with ion sputtering for material removal. Laser ablation or plasma etching is also an option, but these approaches are less commonly applied.…”
Section: Introductionmentioning
confidence: 99%