Assembly and solder joint reliability of plastic ball grid array with lead-free versus lead-tin interconnect

Levis, K.-M.; Mawer, Andrew

doi:10.1109/ectc.2000.853326

Cited by 25 publications

(10 citation statements)

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“…This behavior does not mean, however, that the Pb‐free solder balls will have a worse fatigue behavior compared to Sn‐Pb. The comparison between SAC and Sn‐Pb PBGA packages has been performed by other researchers (Qi et al , 2006; Levis and Mawer, 2000). Qi et al performed a study on the effect of temperature profile in ATC of Sn‐Pb and SAC solder joints, and they concluded that the SAC alloy always performed better than the Sn‐Pb, regardless of temperature range.…”

Section: Resultsmentioning

confidence: 99%

Thermal cycling of lead‐free Sn‐3.8Ag‐0.7Cu 388PBGA packages

Andersson

Vandevelde

Noritake

et al. 2009

Soldering &Amp; Surface Mount Technology

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PurposeThe purpose of this paper is to assess the effect of different temperature cycling profiles on the reliability of lead‐free 388 plastic ball grid array (PBGA) packages and to deeply understand crack initiation and propagation.Design/methodology/approachTemperature cycling of Sn‐3.8Ag‐0.7Cu PBGA packages was carried out at two temperature profiles, the first ranging between −55°C and 100°C (TC1) and the second between 0°C and 100°C (TC2). Crack initiation and propagation was analyzed periodically and totally 7,000 cycles were run for TC1 and 14,500 for TC2. Finite element modeling (FEM), for the analysis of strain and stress, was used to corroborate the experimental results.FindingsThe paper finds that TC1 had a characteristic life of 5,415 cycles and TC2 of 14,094 cycles, resulting in an acceleration factor of 2.6 between both profiles. Cracks were first visible for TC1, after 2,500 cycles, and only after 4,000 cycles for TC2. The crack propagation rate was faster for TC1 compared to TC2, and faster at the package side compared to the substrate side. The difference in crack propagation rate between the package side and substrate side was much larger for TC1 compared to TC2. Cracks developed first at the package side, and were also larger compared to the substrate side. The Cu tracks on the substrate side affected the crack propagation sites and behaved as SMD. All cracks propagated through the solder and crack propagation was mainly intergranular. Crack propagation was very random and did not follow the distance to neutral point (DNP) theory. FEM corroborated the experimental results, showing both the same critical location of highest creep strain and the independence of DNP.Originality/valueSuch extensive work on the reliability assessment of Pb‐free 388 PBGA packages has never been performed. This work also corroborates the results from other studies showing the difference in behavior between Pb‐free and Pb‐containing alloys.

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Section: Resultsmentioning

confidence: 99%

Thermal cycling of lead‐free Sn‐3.8Ag‐0.7Cu 388PBGA packages

Andersson

Vandevelde

Noritake

et al. 2009

Soldering &Amp; Surface Mount Technology

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“…Testing and modeling of lead-free CSPs (single die) are also investigated [17,18]. However, there are few publications available on lead-free stacked die BGA with mixed FC-WB interconnect, and detailed analyses of design parameters.…”

Section: Introductionmentioning

confidence: 99%

Board level solder joint reliability analysis of stacked die mixed flip-chip and wirebond BGA

Tee

Zhong

2006

Microelectronics Reliability

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“…Different researchers have used different criteria, for example, a resistance threshold of 450Ω [2], an increase in resistance of 10Ω or greater [3], the resistance change of 5Ω [4]. The majority of the studies such as in references [5][6][7][8][9] use criteria defined in one of five standards [10][11][12][13][14], depending on the kind of reliability test. For temperature cycling testing, the industry-wide guideline was IPC-SM-785 (released in 1992).…”

Section: Introductionmentioning

confidence: 99%

A Study of Solder Joint Failure Criteria

Pan

Silk

2011

International Symposium on Microelectronics

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One of the challenges in an experimental study of solder joint reliability is to determine when cracks occur in a solder joint or when a solder joint fails. Cracks in a real solder joint are difficult to identify using an X-Ray system. Cross-sectioning and scanning electron microscopy (SEM) is a destructive method. A common non-destructive test method is to monitor resistance increase in a solder joint or a daisy-chain. However, no scientific research has been done in establishing the relationship between the crack area of an interconnection and the change in resistance of the interconnection. This paper proposes a method of defining failure criteria as the resistance increase in a solder joint exceeding a threshold. The threshold is determined by k times the range over the natural variation in resistance measured by a measurement system. The natural variation by random cause is judged using X-bar and R charts. The principles of defining failure criteria are to be able to detect failure of solder joints as early as possible with minimum false detection due of measurement system error/variation. An experimental study confirmed that a full crack of an interconnection occurs when the increase of resistance in the interconnection is 10 times the natural variation of resistance change. The results of this study could be used to narrow the definition of failure in consensus standards IPC 9701A, JESD22-B111, and IPC/JEDEC-9702.

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Assembly and solder joint reliability of plastic ball grid array with lead-free versus lead-tin interconnect

Cited by 25 publications

References 0 publications

Thermal cycling of lead‐free Sn‐3.8Ag‐0.7Cu 388PBGA packages

Thermal cycling of lead‐free Sn‐3.8Ag‐0.7Cu 388PBGA packages

Board level solder joint reliability analysis of stacked die mixed flip-chip and wirebond BGA

A Study of Solder Joint Failure Criteria

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