Advances in the drop-impact reliability of solder joints for mobile applications

Wong, E.H.; Seah, S.K.W.; Driel, W.D. van; Caers, J.F.J.M.; Owens, N.; Lai, Yi‐Shao

doi:10.1016/j.microrel.2008.12.001

Cited by 57 publications

(26 citation statements)

References 15 publications

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“…21 Since the solder joints tested in this work were reflowed twice, the thickness of the interfacial IMC layers is expected to be larger than after a single reflow, contributing to the high amount of interfacial IMC failures observed in this work. The apparent disagreement between this work and prior studies, which reported exclusively ductile failures in the joint bulk for Sn-Pb solders on ENIG finish, 7,8,10,17,18,30 may be explained in terms of the employed loading rates that were usually lower than the loading rate used in this study (3.16 m/s). A study supporting the findings of the present work reported the decrease in the amount of ductile failures in the bulk of Sn-37%Pb joints on ENIG finish (in this case, formed after a single reflow) from $95% at a loading rate of 10 mm/s to $40% at a rate of 3 m/s during high-speed ball shear tests.…”

Section: Discussion Of Impact Test Resultscontrasting

confidence: 98%

“…One of the main reliability concerns related to the performance of these solders is their undesirably high sensitivity to impact when compared with the Sn-37%Pb solder, which exhibits better impact resistance. [1][2][3][4][5][6][7][8][9][10] This has been attributed to the fact that Sn-37%Pb is more compliant than the Sn-based solders: its greater ability to deform allows better accommodation of the stresses at the solder/bond pad interface before the stress level in the interfacial intermetallic compounds (IMCs) becomes critical and leads to their failure. 3,11 The satisfactory impact reliability required from portable electronics essentially means that a portable device must survive many accidental drops, each one of which produces local strain rates of $1000 s À1 .…”

Section: Introductionmentioning

confidence: 99%

“…[32][33][34]36 The study presented in this article focuses on a new mode of brittle failure; this failure mode occurs in the solder bulk, unlike the other modes of brittle failure so far identified in the literature. In fact, the previous studies recognized explicitly three basic failure modes for Sn-based solders: ductile failures in the solder bulk, brittle failures at the interfacial IMC layers, and mixed ductile-brittle failures; 1,2,[7][8][9][10][11]15,[18][19][20] some studies further divided mixed failures into quasi-ductile (>50% of the bond pad is covered by solder) and quasi-brittle (<50% of the bond pad is covered by solder). 5,16,[26][27][28] The conviction that all failures in the solder bulk are ductile as opposed to the brittle failures occurring in the interfacial IMC layers is also reflected in two Joint Electron Devices Engineering Council (JEDEC) standards: (a) JESD22-B117A on ''Solder Ball Shear,'' 37 and (b) JESD22-B115 on ''Solder Ball Pull,'' 38 the latter including high-speed testing.…”

Section: Introductionmentioning

confidence: 99%

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A Novel Mechanism of Embrittlement Affecting the Impact Reliability of Tin-Based Lead-Free Solder Joints

Lambrinou

Maurissen

Limaye

et al. 2009

Journal of Elec Materi

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This work addresses a new mode of brittle failure that occurs in the bulk of tin-based lead-free solder joints, unlike the typical brittle failures that occur in the interfacial intermetallics. Brittle failures in the joint bulk result from the low-temperature ductile-to-brittle transition in the fracture behavior of b-tin. The bulk embrittlement of these joints is discussed by referring to the results of impact tests performed on both solder joints and bulk solder specimens. The mechanism of bulk embrittlement is largely explained based on the results of a fractography study performed on the bulk joint failures using scanning electron microscopy.

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Section: Discussion Of Impact Test Resultscontrasting

confidence: 98%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

See 1 more Smart Citation

A Novel Mechanism of Embrittlement Affecting the Impact Reliability of Tin-Based Lead-Free Solder Joints

Lambrinou

Maurissen

Limaye

et al. 2009

Journal of Elec Materi

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“…A European consortium [58] was formed with the objectives of establishing test methodologies at PWB and at package levels and exploring for a universal failure model independent of the test methods. Various mechanical tests, including drop, cyclic bend, and ball impact, were performed to establish stress-strain properties, S -N fatigue relationship, crack propagation behavior, and damage accumulation characteristic of lead-free solder joints.…”

Section: Discussionmentioning

confidence: 99%

Thermal Cycle and Vibration/Drop Reliability of Area Array Package Assemblies

Ghaffarian

2011

Structural Dynamics of Electronic and Photonic Systems

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SUMMARYCommercial off-the-shelf area array packaging (COTS AAP) technologies are considered for use in a number of high-reliability electronics systems. Understanding the process and quality assurance (QA) indicators for reliability, as well as developing methods to project life under thermal and mechanical environment, is important for the low-risk insertion of these newly available electronic packages. Extensive investigations were performed by NASA in collaboration with industry and universities to address key manufacturing and reliability issues on the continuously evolving AAP technology. The reliability results based on test data will facilitate use of various low-pitch and high-input/output (I/O) area array packages, with more processing power in a smaller board footprint. Topics discussed in this chapter are as follows:• Packaging technology trend for AAPs, including plastic ball grid array (PBGA), chipscale packages (CSPs), and 3D stack packages. • Summary of key parameters that affect assembly reliability of PBGAs and flip-chip BGA (FCBGA) based on a comprehensive literature search. The effect of a doublesided mirror image array package on solder joint reliability is also addressed. IPC 9701A specification was reviewed for lead-free solder alloy requirements. • Test results for a test vehicle having various packages including a PBGA with 1156 I/Os subjected to various thermal cycling. X-ray and scanning electron microscopy (SEM) and X-sections after thermal cycling. • Literature survey and test results for a COTS PBGA 676 I/O package assembly with various ball/solder alloys representing the current migration of industry to lead-free solders. A number of test vehicles, assembled and supplied by an engineering manufacturing service (EMS) company collaborator, were subjected to thermal cycling evaluation as part of collaboration activity. The test results are presented. • The test results for thermal cycling and vibration of numerous CSPs soldered with tin-lead and with and without underfill are presented. • Extensive vibration and thermal cycle data were generated by the consortium team members of the Joint Council on Aging Aircraft/Joint Group on Pollution Prevention (JCAA/JG-PP). Vibration test results for BGA 225 I/O package assemblies with tin-lead and lead-free solder were reviewed and compared with other models and 519

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“…Contemporary products are required to withstand loadings at levels, described in international and local standards. [2,6] Human operated packages and containers are tested in many ways to determine their properties. The manufactures are required to demonstrate that the products can withstand loads that could occur under operation and accident conditions.…”

Section: Introductionmentioning

confidence: 99%

Virtual prototyping of drop test using explicit analysis

Todorov

Kamberov

2017

AIP Conference Proceedings

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Abstract. Increased requirements for reliability and safety, included in contemporary standards and norms, has high impact over new product development. New numerical techniques based on virtual prototyping technology, facilitates imrpoving product development cycle, resutling in reduced time/money spent for this stage as well as increased knowledge about certain failure mechanism. So called "drop test" became nearly a "must" step in development of any human operated product. This study aims to demonstrate dynamic behaviour assessment of a structure under impact loads, based on virtual prototyping using a typical nonlinear analysis -explicit dynamics. An example is presneted, based on a plastic container that is used as cartridge for a dispenser machine exposed to various work conditions. Different drop orientations were analyzed and critical load cases and design weaknesses have been found. Several design modifications have been proposed, based on detailed analyses results review.

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Advances in the drop-impact reliability of solder joints for mobile applications

Cited by 57 publications

References 15 publications

A Novel Mechanism of Embrittlement Affecting the Impact Reliability of Tin-Based Lead-Free Solder Joints

A Novel Mechanism of Embrittlement Affecting the Impact Reliability of Tin-Based Lead-Free Solder Joints

Thermal Cycle and Vibration/Drop Reliability of Area Array Package Assemblies

Virtual prototyping of drop test using explicit analysis

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