A Novel Mechanism of Embrittlement Affecting the Impact Reliability of Tin-Based Lead-Free Solder Joints

Lambrinou, Konstantina; Maurissen, W.; Limaye, Paresh; Vandevelde, Bart; Verlinden, Bert; Wolf, Ingrid De

doi:10.1007/s11664-009-0841-0

Cited by 23 publications

(4 citation statements)

References 14 publications

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“…Through a large number of experiments, researchers have found that when the temperature gradually decreases, the ductile fracture strength of different solder material significantly increases [29]. When the temperature reaches the transition temperature range, the fracture characteristic of solders changes obviously, as well as the energy required for fracture.…”

Section: Methodsmentioning

confidence: 99%

Failure Analysis of SAC305 Ball Grid Array Solder Joint at Extremely Cryogenic Temperature

Wan

et al. 2020

Applied Sciences

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To verify the reliability of a typical Pb-free circuit board applied for space exploration, five circuits were put into low temperature and shock test. However, after the test, memories on all five circuits were out of function. To investigate the cause of the failure, a series of methods for failure analysis was carried out, including X-ray detection, cross-section analysis, Scanning Electron Microscope (SEM) analysis, and contrast test. Through failure analysis, the failure was located in the Pb-free (Sn-3.0Ag-0.5Cu) solder joint, and we confirmed that the failure occurred because of the low temperature and change of fracture characteristic of Sn-3.0Ag-0.5Cu (SAC305). A verification test was conducted to verify the failure mechanism. Through analyzing data and fracture surface morphology, the cause of failure was ascertained. At low temperature, the fracture characteristic of SAC305 changed from ductileness to brittleness. The crack occurred at solder joints because of stress loaded by shock test. When the crack reached a specific length, the failure occurred. The temperature of the material’s characteristic change was −70–−80 °C. It could be a reference for Pb-free circuit board use in a space environment.

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Section: Methodsmentioning

confidence: 99%

Failure Analysis of SAC305 Ball Grid Array Solder Joint at Extremely Cryogenic Temperature

Wan

et al. 2020

Applied Sciences

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“…In a previous study we focused on the ductile to brittle transition (DBTT) of pure Sn, using Insitu micromechanical testing to probe the deformation mechanisms above and below the DBTT 1 . Since Sn is the major constituent of most solders used in industry, our first study focused on the pure Sn with no other alloy element present given that the body centered tetragonal (bct) crystal structure β-Sn dictates the global mechanical properties of most solders 2 . The bct structure gives rise to several unique deformation mechanisms that change as a function of temperature, strain rate and orientation.…”

Section: Introductionmentioning

confidence: 99%

“…These joints provide both electrical connections and mechanical support for the electrical package. Differences in the thermal expansion coefficients of materials used in electronic packaging cause cyclical strains in the solder joints upon thermal cycling [1][2] . Reliability of the solder joint depends upon a number of mechanical and microstructural evolutionary processes that occur interactively during its service lifetime.…”

Section: Introductionmentioning

confidence: 99%

Cryogenic in-situ clamped beam testing of Sn96

Lupinacci

Kacher

Shapiro

et al. 2021

Journal of Materials Research

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The deformation behavior of materials that exhibit a ductile to brittle transition have traditionally been characterized ex-situ and limited to bulk samples. Here, we use a unique experimental setup to perform in situ cryogenic mechanical testing of Sn 96 solder alloy in a clamped beam configuration at -142C, well below the alloy's DBTT. Electron backscattered diffraction analysis before and after the in situ experiments showed how deformation ahead of the crack tip is accommodated by the Sn matrix or intermetallic phase particles. Similar to behavior observed in pure Sn, within the Sn matrix of the Sn 96 alloy deformation twinning is the primary deformation mechanism below the DBTT. Similar to the twins previously observed in pure Sn, twinning behavior in the Sn matrix is consistent with the formation of the {301} and {101} twins in Sn. Within the intermetallic phase in Sn96, slip steps were observed that were not observed prior to bending.

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“…Recently, for studying the response of solder joints to dynamic loading at low temperatures, Ong et al (2004) performed a series of high‐speed cyclic bend tests to report a sharp change in the 98.9Sn‐1Ag‐0.1Cu (SAC101) solder joint failure from ductility at RT to brittleness at −10°C. Lambrinou et al (2009) conducted a board‐level impact assessment employing a miniature Charpy test, conducting observations of the brittle failure of Sn‐based and Pb‐free solders at low temperatures. The results demonstrated that low‐temperature embrittlement affected the impact reliability of solder joints.…”

Section: Introductionmentioning

confidence: 99%

A novel high speed impact testing method for evaluating the low temperature effects of eutectic and lead‐free solder joints

Liu

Hsu

Kuo

et al. 2012

Soldering &Amp; Surface Mount Technology

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2010),"Multidimensionality: building the mind/brain infrastructure for the next generation knowledge worker", On the Horizon, Vol. 18 Iss 3 pp. 240-254 http://dx.If you would like to write for this, or any other Emerald publication, then please use our Emerald for Authors service information about how to choose which publication to write for and submission guidelines are available for all. Please visit www.emeraldinsight.com/authors for more information. About Emerald www.emeraldinsight.comEmerald is a global publisher linking research and practice to the benefit of society. The company manages a portfolio of more than 290 journals and over 2,350 books and book series volumes, as well as providing an extensive range of online products and additional customer resources and services.Emerald is both COUNTER 4 and TRANSFER compliant. The organization is a partner of the Committee on Publication Ethics (COPE) and also works with Portico and the LOCKSS initiative for digital archive preservation. AbstractPurpose -The purpose of this paper is to present a novel high speed impact testing method for evaluating the effects of low temperatures on eutectic and lead-free solder joints. Interfacial cracking failure of Sn-based and Pb-free solders at subzero temperatures is of significant concern for electronic assemblies that operate in harsh environments. Design/methodology/approach -This paper presents a newly designed low temperature control system coupled with an Instron micro-impact testing machine, which offers a package level test for solder bumps, and that is used at subzero temperature ranges as low as 2408C. This study examined the failure characteristics of 63Sn-37Pb (Sn37Pb) and 96.5Sn-3Ag-0.5Cu (SAC305) solder joints at temperatures ranging from room temperature (R.T.) to 2 408C, and at impact speeds of 1 m/s. Findings -Three types of failure mode were identified: M1 interfacial fracture with no residual solder remaining on the pad (interfacial cracking); M2 interfacial fracture with residual solder persisting on the pad (mixed mode failure); and M3 solder ball fracture (bulk solder cracking). The experimental results indicated that the energy to peak load for both types of solders decreased significantly, by approximately 35 percent to 38 percent when the test temperature was reduced from R.T. to 2408C. In addition, the peak load of the Sn37Pb solder joint increased noticeably with a decreasing test temperature. However, the peak load of the SAC305 specimen remained virtually unchanged with a reduction in the temperature. The Sn37Pb solder joints failed in an M3 failure mode under all the considered testing temperatures. The SAC305 solder joints displayed both M1 and M2 failure modes at R.T.; however, they failed almost exclusively in M1 mode at the lowest test temperature of 2 408C. Originality/value -This paper presents a novel technique for evaluating high-speed impact strength and energy absorbance of Sn-based and Pb-free solders at the chip level within a low temperature control system. To overcome the drawb...

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A Novel Mechanism of Embrittlement Affecting the Impact Reliability of Tin-Based Lead-Free Solder Joints

Cited by 23 publications

References 14 publications

Failure Analysis of SAC305 Ball Grid Array Solder Joint at Extremely Cryogenic Temperature

Failure Analysis of SAC305 Ball Grid Array Solder Joint at Extremely Cryogenic Temperature

Cryogenic in-situ clamped beam testing of Sn96

A novel high speed impact testing method for evaluating the low temperature effects of eutectic and lead‐free solder joints

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