A Fast Approach for Simulating Long-Time Response of High-Speed Dispersive and Lossy Interconnects Terminated With Nonlinear Loads

Chiu, Cheng‐Nan; Chiang, I-Ting

doi:10.2528/pier09021502

Cited by 13 publications

(12 citation statements)

References 26 publications

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“…Despite this fascinating scenario of technological development, the structures of the current interconnection circuitry between the logic gates, electronic chips and digital devices, and even the buses linking the different electronic boards as seen in Fig. 1 become more and more complicated [2][3][4][5][6][7]. Furthermore, due to the incessant increase of the operating frequencies and the integration density, the contributions of the interconnection electric parameters as the resistance, capacitance and inductance effects [8][9][10][11][12][13][14][15] cannot presently be neglected by the electronic equipment manufacturers.…”

Section: Introductionmentioning

confidence: 99%

Transient Response Characterization of the High-Speed Interconnection RLCG-Model for the Signal Integrity Analysis

Eudes¹,

Ravelo²,

Louis³

2011

PIER

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Abstract-This paper is devoted on the characterization method of RF/digital PCB interconnections for the prediction of the highspeed signal transient responses. The introduced method is based on the use of the interconnection line RLCG-model. Theoretical formulae enabling the extraction of the electrical per-unit length parameters R, L, C and G in function of the interconnection line physical characteristics (width, length, metal conductivity, dielectric permittivity . . . ) are established. Then, by considering the second order approximation of the interconnection RLCG-model transfer matrix, the calculation process of the transient responses from the interconnection system transfer function is originally established. To demonstrate the relevance of the proposed model, microwavedigital interconnection structure comprised of millimetre microstrip line driven and loaded by logic gates which are respectively modelled by their input and output impedances was considered. Then, comparisons between the SPICE-computation results and those obtained from the proposed analytical model implemented in Matlab were made. As results, by considering a periodical square microwave-digital excitation signal with 2 Gbits/s rate, transient responses which are very wellcorrelated to the SPICE-results and showing the degradation of the tested signal fidelity are observed. The numerical computations confirm that the proposed modelling method enables also to evaluate accurately the transient signal parameters as the rise-/fall-times and the 50% propagation delay in very less computation time. For this reason, this analytical-numerical modelling method is potentially interesting for the analysis of the signal integrity which propagates

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Section: Introductionmentioning

confidence: 99%

Transient Response Characterization of the High-Speed Interconnection RLCG-Model for the Signal Integrity Analysis

Eudes¹,

Ravelo²,

Louis³

2011

PIER

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“…A book treating deeply the recursive convolution is that of [25]. More recently, Chiu and Chiang [26] presented a convolution approach for analyzing the long-time response of high-speed dispersive and lossy interconnects terminated with nonlinear loads. Although nowadays the state of the art in modeling interconnects tends to the generation of parametric macromodels [27][28][29][30][31] where direct use of the timeconsuming convolution process is omitted, the transient-analysis convolution-based technique is still completely applicable.…”

Section: Introductionmentioning

confidence: 99%

Influence of Measured Scattering Parameters on the Convolution Simulation of Nonlinear Loaded High-Speed Microstrip Interconnects

CÃ¡rdenas

Jiménez²

2011

PIER M

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The simulation of nonlinear loaded high-speed microstrip interconnects by means of a convolution-based procedure is described when both, analytical and measured scattering parameters are used. Closed-form equations are employed to obtain the analytical scattering parameters. The influence of measured scattering parameters, when these are used instead the analytical ones, is investigated to know how the microstrip interconnect responses are affected. The convolution procedure is complemented by including the transmission line linear equation and the microwave circuit reflection theory.

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“…It is obvious that the value of W x corresponding to the second-order central finite-difference scheme is a real number. Subsequently, the eigenvalues associated with the proposed method can be represented as (15). Since |r 1,2 | = 1, it can be concluded that the novel FDTD method is unconditionally stable.…”

Section: Numerical Stability and Dispersion Analysismentioning

confidence: 99%

“…However, the discretization grid with an adequate temporal resolution must be chosen for the Courant-Friedrich-Levy (CFL) stability condition [15], which leads to expensive simulation cost. In an attempt to improve the FDTD computation efficiency, two main alternatives have been proposed: the first one is to incorporate an implicit difference scheme into the basic algorithm [16], and the second one is to use a semidiscrete model based on a time-step integration method [17,18].…”

Section: Introductionmentioning

confidence: 99%

An Unconditional Stable 1d-FDTD Method for Modeling Transmission Lines Based on Precise Split-Step Scheme

Wang¹,

Liu²,

Qin³

2013

PIER

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Abstract-This paper presented a novel unconditional stable FDTD (US-FDTD) algorithm for solving the transient response of uniform or nonuniform multiconductor transmission line with arbitrary coupling status. Analytical proof of unconditional stability and detailed analysis of numerical dispersion are presented. The precise split-time-step scheme has been introduced to eliminate the restriction of the CourantFriedrich-Levy (CFL) condition. Compared to the conventional US-FDTD methods, the proposed approach generally achieves lower phase velocity error for coarse temporal resolution. So larger time scales can be chosen for the transient simulation to achieve accurate results efficiently. Several examples of coupled uniform and nonuniform lines are presented to demonstrate the accuracy, stability, and efficiency of the proposed model.

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A Fast Approach for Simulating Long-Time Response of High-Speed Dispersive and Lossy Interconnects Terminated With Nonlinear Loads

Cited by 13 publications

References 26 publications

Transient Response Characterization of the High-Speed Interconnection RLCG-Model for the Signal Integrity Analysis

Transient Response Characterization of the High-Speed Interconnection RLCG-Model for the Signal Integrity Analysis

Influence of Measured Scattering Parameters on the Convolution Simulation of Nonlinear Loaded High-Speed Microstrip Interconnects

An Unconditional Stable 1d-FDTD Method for Modeling Transmission Lines Based on Precise Split-Step Scheme

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