2014
DOI: 10.1016/j.proeng.2014.11.395
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A 3D FEM Model for Heat Transfer Mechanisms in Membrane Based Thermal Conductivity Sensors Developed Using SOI CMOS MEMS Technology

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Cited by 3 publications
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“…Other key advantages of the SOI micro-hotplates are their very low power consumption and high temperature uniformity across the heater sensing area [25]. The use of a commercial CMOS process means that the devices can be fabricated in high volume (millions), at low unit costs.…”
Section: Methodsmentioning
confidence: 99%
“…Other key advantages of the SOI micro-hotplates are their very low power consumption and high temperature uniformity across the heater sensing area [25]. The use of a commercial CMOS process means that the devices can be fabricated in high volume (millions), at low unit costs.…”
Section: Methodsmentioning
confidence: 99%