<p>Traditional wooden temples in Japan are constructed by construction methods which use natural materials and allow easy teardown. By extending the life of buildings by periodical repair, wooden temples produce only low environmental loads. The roof tiles are replaced in every hundred years so that the waterproof property is maintained, and the whole building is torn down and damaged parts are replaced in every several hundred years so that the structural performance is assured.</p><p>When an earthquake occurs, easily replaceable parts resist, and the buildings become tough anti- seismic structures due to their deformation capacity given by wood denting.</p><p>This paper introduces a repair case of the world’s largest wooden temple. In this case, the anti- seismic capacity is reevaluated by the modern technology, and then efficient reinforcement is achieved. In addition, deteriorated roof tiles are utilized as a component of another useful material.</p>
This paper describes novel MEMS probe card device, which is composed of silicon (Si)
cantilever beams actuated by titanium-nickel (Ti-Ni) shape memory alloy (SMA) films. Since Ti-Ni
SMA film can yield a higher work output per unit volume, Ti-Ni film-actuated Si cantilever beam is
expected to be a MEMS probe card device providing large contact force between probe and electrode
pad. The developed cantilever beam produces a contact force by not only cantilever bending in
contact but also the shape memory effect (SME) of Ti-Ni film arising from Joule’s heating. The SME
of Ti-Ni film containing Ti of 50.5 atomic (at.) % to 53.2 at. % can generate an additional contact
force of 200 μN on average under applying an electric power of 500 mW to the film. Ti-Ni
film-actuated Si cantilever beam would be a key element for successful MEMS probe card with larger
contact force and smaller size.
Direct and quantitative observation of the stress generation during HVOF spray is carried out by measuring the curvature of substrates in-situ during spraying. A high pressure HVOF gun is used to spray SUS316L, Hastelloy C and WC-12%Co powder onto SUS316L substrates. The observed curvature data indicate that there are 3 regimes of stress evolution during the HVOF spray: (1) generation of compressive stress on the substrate surface at the beginning of spraying, (2) stress buildup in the coating during spraying, and (3) superposition of stress due to the mismatch in the thermal expansivity between the coating and the substrate as the specimen cools down to the room temperature after fabrication. Compressive stress ranging from 70 to 400 MPa is observed in the second regime during the HVOF spray; the value depending on the powder materials and spray conditions. Microstructural observation reveals that a significant portion of the coatings consists of poorly molten particles. Beneath the coatings formed by the HVOF process, a thin layer of increased hardness exists within the substrate.
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