Ti-Ni SMA film actuated Si cantilever beams for MEMS probe card

Namazu, Takahiro; Inoue, Shozo; Tashiro, Yasuhiko; Okamura, Y.; Koterazawa, Keiji

doi:10.1109/sensor.2005.1496521

Cited by 10 publications

(11 citation statements)

References 3 publications

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“…The contact resistance measured in this study is only a little different to that noted in other reports [23]- [25]. Their measurement values are within several to a few dozen ohms, depending on testing conditions.…”

Section: B Electrical and Mechanical Testcontrasting

confidence: 72%

A Novel Micromachined Claw Probe for the Electrical Testing of Microsolder Ball

Tsou

Lai

Huang

2012

J. Microelectromech. Syst.

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This paper presents a micromachined claw probe with electroplating nickel for microsolder ball electrical testing applications. The suspension claw structure consists of two bridges and four curved cantilevers, which have a flexible spring constant in a small region. The out-of-plane claw-probe unit was fabricated using silicon bulk micromachining, titanium deposition, and nickel electroplating processes. The typical bending cantilever structure, made by nickel electroplating, had a thickness of 6.5 μm, a width of 10 μm, and a length of 80 μm. The maximum out-of-plane deflections of the fabricated 40 × 40 claw-probe array were approximately 50 ± 1.2 μm, under the effect of residual tensile stress of 923 MPa. For the probing test of the microsolder ball with a diameter of 200 μm, under the contact force of 1.75 mN, the measured path resistance was about 30 Ω, and the moving stroke of the microsolder ball was 14 μm. The extendable overdrive stroke was over 30 μm, after probe contact with the microsolder ball, and obvious damage was not observed on the surfaces of the claw probe except for several slight scrapes on the sidewall of the microsolder ball. This probe card is potentially capable of providing a very large number of micromachined probes in an array format and can also satisfy the requirements for a fine-pitch ball grid array and low-cost wafer-level testing.[ 2011-0299]Index Terms-Claw probe, electroplated nickel, microsolder ball, residual stresses.

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Section: B Electrical and Mechanical Testcontrasting

confidence: 72%

A Novel Micromachined Claw Probe for the Electrical Testing of Microsolder Ball

Tsou

Lai

Huang

2012

J. Microelectromech. Syst.

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“…The resulting increase in wafer size means that probe cards must also become larger and thus more expensive. Various types of probe cards are manufactured, including epoxy, blade, vertical, array, and microspring types [1][2][3][4][5][6][7][8]. The emerging microspring microelectromechanical system (MEMS) probe card is beginning to dominate wafer testing [9][10][11][12].…”

Section: Introductionmentioning

confidence: 99%

Probe Array from BeCu Metal Sheet Using Heat and Fusing Currents

Kim¹,

Cho²,

Kim³

2018

IJET

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A probe array fabricated from a beryllium-copper metal sheet was developed in order to produce cost-effective microelectromechanical system (MEMS) probe cards. The probe array is fabricated via a simple, inexpensive process in which a heat current is used for annealing and a fusing current from a DC power supply is used for cutting the metal sheet. The stress relaxation time was 7 min during the application of a 4 A heat current, and the fusing current was 20 A. The contact force was approximately 1 gram force at a deflection of 100 μm, and the contact resistance from the tip of the probe to the end of the probe beam was 1.9 Ω. The probe array is suitable for use in probe cards, test sockets, and various types of manufacturing equipment.

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“…Under these conditions, Ni alloys, especially Ni-Co, are conventionally used for micro-probes because of their suitable properties and affordable fabrication processes, such as electroplating [2,[5][6][7][8][9][10]. However, since integration has increased continuously over the years, there is a growing need to find another material to meet the stringent requirements.…”

Section: Introductionmentioning

confidence: 99%

MEMS-based Ni–B probe with enhanced mechanical properties for fine pitch testing

Kim

Kwon

Ahn

et al. 2017

Micro and Nano Syst Lett

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We fabricated and characterized microelectromechanical systems (MEMS)-based Ni-B probes with enhanced mechanical properties for fine pitch testing. The Ni-B micro-probes were compared with conventional Ni-Co microprobes in terms of the mechanical performance and thermal effect. The elastic modulus and hardness of Ni-B were found to be 240.4 and 10.9 GPa, respectively, which surpass those of Ni-Co. The Ni-B micro-probes had a higher contact force than the Ni-Co micro-probes by an average of 41.38% owing to the higher elastic modulus. The Ni-B micro-probes had a lower average permanent deformation than the Ni-Co micro-probes after the same overdrive was applied for 1 h by 56.58 µm. The temperature was found to have a negligible effect on the Ni-B micro-probes. These results show that Ni-B micro-probes are useful for fine pitch testing and a potential candidate for replacing conventional Ni-Co micro-probes owing to their advanced mechanical and thermal characteristics.

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Ti-Ni SMA film actuated Si cantilever beams for MEMS probe card

Cited by 10 publications

References 3 publications

A Novel Micromachined Claw Probe for the Electrical Testing of Microsolder Ball

A Novel Micromachined Claw Probe for the Electrical Testing of Microsolder Ball

Probe Array from BeCu Metal Sheet Using Heat and Fusing Currents

MEMS-based Ni–B probe with enhanced mechanical properties for fine pitch testing

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