The interface between diamond and silicon, fabricated by growing diamond films on (001) silicon by microwave plasma assisted chemical vapor deposition (MPACVD), was characterized by high-resolution transmission electron microscopy (HRTEM) and electron energy loss spectroscopy (EELS). Two types of interface morphology were identified. Type A interfaces contain an amorphous transition layer composed of silicon, carbon, and oxygen; the diamond overgrowth on this layer consists of nanocrystalline grains with random orientations. Type B interfaces consist of large diamond grains having special orientations with respect to the silicon substrate, without an obvious presence of a glassy phase and with a much lower oxygen content than type A interfaces.
The interfacial structure of CVD diamond grown on silicon was studied using spatially resolved electron energy loss spectroscopy (EELS) in a UHV STEM with a subnanometer probe size. Both the plasmon and core excitations in the bulk appear to be localized on this scale. Spatial maps of the different bonding configurations of carbon were obtained by forming images from transmitted electrons that had undergone energy losses characteristic of threefold and fourfold coordinated carbon. Films grown on both prescratched silicon and intermediate amorphous carbon layers were examined. In the latter case, diamond nucleation on a narrow sp2 a-C occurred. For diamond grown directly on silicon, at some regions of the interface, threefold coordinated defect states smaller than 1 nm are observed on the diamond side of the interface while at other regions along the interface the presence of an intermediate 2nm thick SiC layer preserves the fourfold coordination of the carbon.
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