The organic low-k hybrid-organic-siloxane-polymer ͑HOSP ® ͒ has been investigated as an intermetal dielectric. The presence of Si-H and Si-CH 3 bonds instead of partial Si-O bonds lowers the dielectric constant compared to conventional siloxane-based spin-on glass. However, dielectric degradation occurs due to the destruction of functional groups in HOSP during the photoresist ashing process. In this work, we have applied NH 3 plasma nitridation to improve the quality of HOSP films. The NH 3 plasma process converts the organic HOSP surface into an inorganic surface by formation of a thin inert SiN x passivation layer. The inert layer can enhance the resistance of the HOSP film to moisture uptake and O 2 plasma attack during photoresist stripping. In addition, it effectively prevents copper from penetrating the HOSP film.
Synthesis of organically modified mesoporous silica as a low dielectric constant intermetal dielectricThe quality of organic low-k methylsilsesquioxane ͑MSQ͒ film is degraded by the damage of oxygen plasma and hygroscopic behavior during photoresist stripping. In addition, the interaction between MSQ and copper is worth investigating. In this work, we have studied the H 2 plasma treatment to improve the quality and enhance the copper penetration resistance of MSQ. Experimental results show the leakage current of MSQ decreases as the H 2 plasma treatment time is increased. The dielectric constant of treated samples also remains constant ͑ϳ2.7͒. In addition, the copper diffusion resistance of MSQ film is significantly promoted. The H 2 plasma treatment can provide additional hydrogen to passivate the inner structure of porous MSQ film as well as reduce the probability of moisture uptake and interaction with Cu atoms. Therefore, the low-k dielectric properties of MSQ are significantly enhanced by H 2 plasma treatment.
The visco-plastic model developed in part I of this work is used here to study the dislocation evolution in high pressure Czochralski growth of InP single crystals. Towards this an in-house computational fluid dynamics code MASTRAPP is linked to the ABAQUS software. MASTRAPP has the capability to predict the thermal field history in the Czochralski furnace throughout the growth period. The thermal loading history determined through MASTRAPP is fed to ABAQUS and the visco-plastic constitutive equations are integrated while maintaining force equilibrium in the growing crystal. The combined model predicts the final dislocation densities in the crystal at the end of the growth period. It is then used to study and predict the effect of various parameters and phenomena on the final dislocation densities-thermal shock, gas convection, height of boric oxide encapsulant layer, marginal roles of thermal radiation and melt convection, and the cool down period. Gas convection is found to have the most significant effect on the dislocation densities.
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