The University of Glasgow-University of Electronic S cience and Technology of China joint education programme enrolled its first cohort of students in Fall 2013. Continual assessment of the programme was initiated shortly thereafter to monitor student achievement in the programme, to evaluate how well the aims of the programme are being met, and to determine areas where improvements can be made. S everal issues were identified during the review as well as in informal conversations with course instructors, administrative support staff, and students. To quantify the impact of these issues, a study to examine the cultural attitudes, English language communication aptitude, problem-solving skills, learning style, and teacher-student relationship of the first cohort during their first year in its undergraduate programme in electronics and electrical engineering has been proposed. The study will adopt an interpretive approach, using a longitudinal multivariate study design, to generate quantified descriptions of how each issue influences student behavior and success in the programme. A follow-on study on the course instructors' cultural attitudes, pedagogical approaches, and willingness to adapt is planned. The initial findings from the programme assessment and the proposed studies will be presented at the
LEDs are subjected to environments with high moisture in many applications. In this paper, the experiments reveal photometric and colorimetric degradation at high humidity. Corresponding spectral power analysis and parameter extraction indicate that the flip-chip bonded LED samples show accelerated chip failure compared to the conventionally bonded samples. The chip-related failure induces greater heat accumulation, which correlates with the increase in heating power observed in the package. However, the temperature rise and thermal resistance for the flip-chip bonded LEDs do not increase substantially as compared to the conventionally bonded LEDs. This is because the junction temperature can be reduced with a flip-chip die-bonding configuration where the heat generated in the LED chip is dissipated effectively onto the AlN substrate, thereby reducing the increase in temperature rise and thermal resistance. The experimental results are supported by evaluation of the derivative structure functions. In addition, as the thermal resistance of the LED package varies with different humidity levels, there is a need to specify the conditions of humidity in data sheets as LED manufacturers routinely specify a universal thermal resistance value under a fixed operating condition.
High-power Light Emitting Diode (LED) generates significant amount of heat fluxes that can affect the temperature-dependent properties of the device. This selfheating effect can upset the measurement setup and produce inaccurate readings, leading to misinterpretation of results such as electrical and thermal resistances. Optical, electrical and thermal performances of high-power LED packages were analysed under different temperature feedback controls. The results of these experiments demonstrate the importance of the temperature control module in the measurement setup affecting the device's properties such as the series resistance R s and the thermal resistance R th . In the electrical currentvoltage measurements, the temperature control module cannot control the self-heating effect effectively, resulting in a lower R s compared to when the measurements are made manually. In transient thermal measurements, it was found that lower R th values are obtained when the controller operates in closedloop adaptive temperature control compared to when it operates in open-loop adaptive temperature control. This paper recommends the manual electrical and open-loop thermal measurement methods for accurate parametric LED analyses.
System order independent short cycle time and latency are indispensable for concurrent implementation of feedback control systems. This paper develops candidate array architectures for the implementation of multivariable systems.
The 17th International Conference on Computer Applications in Shipbuilding (ICCAS) will review operational experience from existing computer applications in the design and build of ships and offshore structures and will cover a full range of topics including; engineering analysis, data modelling, PLM, CAD, CAM, integrated systems, knowledge management, systems engineering, simulation, visualisation, processes and standards.It will also examine the advances in Information Technology which have contributed to increased productivity in both shipbuilding and maritime operations; including increasing co-operative working between shipyards, marine equipment and system manufacturers, engineering partners and shipping companies.These conference attract a large International audience and provide an excellent forum for both those developing and using computer applications in shipbuilding. Venue
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