For the purpose of investigating the effect of cutting edge truncation on ground surface morphology, several kinds of hard and brittle materials used for optical devices, borosilicate glass, glass quartz, crystal quartz and sapphire, are plunge ground with a SD600 metal-bonded grinding wheel, the cutting edges of which are truncated so as to be aligned with the height level of the grinding wheel working surface, after electrocontact discharge truing and dressing. It is found that an
improvement of roughness can be obtained for every material investigated, although the degree of roughness improvement depends on the kind of material. Ductile-mode grinding is most likely to be realized in the case of crystal quartz.
Surface plunge gr 孟 nding of g 正 ass quartz is conducted w 量 th a SD270 metal − bonded diamond wheel , the cutting ¢ dges of which are truncated so as to be aligned with the height of the grinding wheel working surface , and the ground surface roughness is investigated in terms of the truncatien dcpth and the workpiece speed . 【 t is fbund that the ground surface roughness decreases with the increase of tuncation depth and converges to a value depending on the workpiece speed . The ground surface roughness decreases with the workpiece speed , and the roughness ofRa 16nm was obtained at the truncation depth of 15pm and the workpiece speed ofO . 6 m ! min. Furthermore , resin − bonded diamond grinding wheels ofvarious mesh sizes are apPlied to the grinding of the glass quartz under the sε e grinding conditions , and it is fbund that the cuUing −edge −truncated SD270 meta 正 一 bonded grinding whee 旦 brings about the roughness better than that obtained from a SD3000 resin − bonded grinding wheel . KeyTvords : Cutting edge truncation , Metal・ bonded diamond wheel , Resin − bonded diamond wheel , Surface roughness
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