214 Grinding of Glass Quartz with Cutting-Edge-Truncated Metal-Bonded Diamond Wheel : Comparison of Ground Surface Roughness with Resin-Bonded Diamond Wheels

Abstract

Surface plunge gr 孟 nding of g 正 ass quartz is conducted w 量 th a SD270 metal − bonded diamond wheel ， the cutting ¢ dges of which are truncated so as to be aligned with the height of the grinding wheel working surface ， and the ground surface roughness is investigated in terms of the truncatien dcpth and the workpiece speed ． 【 t is fbund that the ground surface roughness decreases with the increase of tuncation depth and converges to a value depending on the workpiece speed ． The ground surface roughness decreases with the workpiece speed ， and the roughness ofRa 16nm was obtained at the truncation depth of 15pm and the workpiece speed ofO ． 6 m ！ min． Furthermore ， resin − bonded diamond grinding wheels ofvarious mesh sizes are apPlied to the grinding of the glass quartz under the sε e grinding conditions ， and it is fbund that the cuUing −edge −truncated SD270 meta 正 一 bonded grinding whee 旦 brings about the roughness better than that obtained from a SD3000 resin − bonded grinding wheel ． KeyTvords ： Cutting edge truncation ， Metal・ bonded diamond wheel ， Resin − bonded diamond wheel ， Surface roughness