Surface plunge gr 孟 nding of g 正 ass quartz is conducted w 量 th a SD270 metal − bonded diamond wheel , the cutting ¢ dges of which are truncated so as to be aligned with the height of the grinding wheel working surface , and the ground surface roughness is investigated in terms of the truncatien dcpth and the workpiece speed . 【 t is fbund that the ground surface roughness decreases with the increase of tuncation depth and converges to a value depending on the workpiece speed . The ground surface roughness decreases with the workpiece speed , and the roughness ofRa 16nm was obtained at the truncation depth of 15pm and the workpiece speed ofO . 6 m ! min. Furthermore , resin − bonded diamond grinding wheels ofvarious mesh sizes are apPlied to the grinding of the glass quartz under the sε e grinding conditions , and it is fbund that the cuUing −edge −truncated SD270 meta 正 一 bonded grinding whee 旦 brings about the roughness better than that obtained from a SD3000 resin − bonded grinding wheel . KeyTvords : Cutting edge truncation , Metal・ bonded diamond wheel , Resin − bonded diamond wheel , Surface roughness
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