This paper reports the study of ultrasonic irradiation effects on electroless copper coating on an epoxide resin. Several parameters were monitored, such as plating rates, practical adhesion and internal stress, versus varying acoustic powers at a constant frequency of 530 kHz. Exposure conditions were characterised by both transmitted power and interfacial mass transfer coefficients. Optimum conditions expressed in irradiation time and power were determined. The use of ultrasound during electroless copper plating affects the plating rates and the deposits properties, particularly the practical adhesion which increases whereas the internal stress decreases. Then, the changes in the coating mechanisms are discussed.
Self-assembly of alkylphosphonic acids on stainless steel was investigated under different conditions. Four different alkylphosphonic acids exhibiting alkyl chain of various size were synthesized and studied: butylphosphonic acid (C4P), octylphosphonic acid (C8P), decylphosphonic acid (C10P), and hexadecylphosphonic acid (C16P). Electrochemistry experiments were extensively carried out in order to determine electrochemical surface blocking of adsorbed layers in function of grafting time. In term of surface blocking, an 8h modification time was optimal for all alkylphosphonic acids. Longer immersion times lead to degradation of adsorbed layers. For the first time, grafting of C16P was studied under high frequency ultrasound irradiation. Interestingly, grafting process is highly accelerated under sonication and well-covering C16P modified substrates are obtained after 1h of immersion under ultrasound irradiation. This would allow to elaborate high-quality alkylphosphonic acids modified samples within much shorter times. Water contact angles measurements and X-ray Photoelectrons Spectroscopy (XPS) confirmed presence of adsorbed alkylphosphonic acids on stainless steel surface. A very tight link between electrochemical blocking, surface hydrophobicity and species chemical grafting was established.
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