Electroless copper coating of epoxide plates in an ultrasonic field

Abstract

This paper reports the study of ultrasonic irradiation effects on electroless copper coating on an epoxide resin. Several parameters were monitored, such as plating rates, practical adhesion and internal stress, versus varying acoustic powers at a constant frequency of 530 kHz. Exposure conditions were characterised by both transmitted power and interfacial mass transfer coefficients. Optimum conditions expressed in irradiation time and power were determined. The use of ultrasound during electroless copper plating affects the plating rates and the deposits properties, particularly the practical adhesion which increases whereas the internal stress decreases. Then, the changes in the coating mechanisms are discussed.

Evolution of Principle and Practice of Electrodeposited Thin Film: A Review on Effect of Temperature and Sonication

“…To cite the effects on deposit are, reduction in grain size [93], change in grain orientation with wave orientation [94], particle agglomeration and increased dispersion [95,96], brighter surface [97] and reduction in residual stress, and hence good adhesion [94,98] have been observed at constant frequency and power output. While with varying frequency and intensity, inconsistent fluctuations in the deposit behavior have also been cited in the literature [94,99]. Ultrasound capable of creating zones of extremely high level of localized supersaturation (due to the high cooling rates in microscopic regions, when bubbles burst) should trigger the nucleation process as observed in the above-mentioned effects.…”

Effects of Brighteners in a Copper Plating Bath on Throwing Power and Thermal Reliability of Plated Through Holes

“…[19,20] The CuNPs were employed as catalysts to replace traditional Sn/Pd catalysts for catalyzing electroless (ELS) copper deposition on the hole wall. [21][22][23][24][25] The ELS copper deposition was performed in a commercialized plating solution (JCU Corporation, Japan) at 40℃ 5/31 for 30 min. The final ELS copper thickness deposited onto the hole wall was about 1~2 m.…”

Effect of Mechanical Attrition on Structure and Property of Electroplated Ni-P Coating on Magnesium Alloy

“…Previous works have shown that ultrasound irradiation can improve electroless deposit adhesion strength. 8 By the pretreatment procedure of pickling with nitric acid plus phosphoric acid, twice activating with K 4 P 2 O 7 and NH 4 HF 2 , a coarse surface was produced on the Mg substrate and a compact Ni-P alloy coating with better adhesion and corrosion resistance was fabricated. 9 Mechanical attrition has been applied during electroless plating to improve the Ni-P coating adhesion and other properties.…”