Effects of Brighteners in a Copper Plating Bath on Throwing Power and Thermal Reliability of Plated Through Holes

Chen, Tzu-Chi; Tsai, Yao-Lin; Hsu, Chia-Fu; Dow, Wei‐Ping; Hashimoto, Yasuo

doi:10.1016/j.electacta.2016.07.007

Cited by 42 publications

(15 citation statements)

References 48 publications

(50 reference statements)

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Since degradation of SPS causes loss of SPS, which is unfavorable for acceleration, replenishment of SPS is an important step to maintain the electroplating quality in the electroplating process. According to the overpotential analysis, Dow et al [46] found that the acceleration performance of three accelerators is in the following order: MPS > 3-S-thiuronium propanesulfonate (UPS) > ZPS. Therefore, the use of ZPS required a higher concentration (20 ppm) so as to have hole-filling performance comparable to low-level MPS (1 ppm).…”

Section: Acceleratormentioning

confidence: 99%

Impurity Effects in Electroplated-Copper Solder Joints

Lee

Chen

2018

Metals

View full text Add to dashboard Cite

Copper (Cu) electroplating is a mature technology, and has been extensively applied in microelectronic industry. With the development of advanced microelectronic packaging, Cu electroplating encounters new challenges for atomic deposition on a non-planar substrate and to deliver good throwing power and uniform deposit properties in a high-aspect-ratio trench. The use of organic additives plays an important role in modulating the atomic deposition to achieve successful metallic coverage and filling, which strongly relies on the adsorptive and chemical interactions among additives on the surface of growing film. However, the adsorptive characteristic of organic additives inevitably results in an incorporation of additive-derived impurities in the electroplated Cu film. The incorporation of high-level impurities originating from the use of polyethylene glycol (PEG) and chlorine ions significantly affects the microstructural evolution of the electroplated Cu film, and the electroplated-Cu solder joints, leading to the formation of undesired voids at the joint interface. However, the addition of bis(3-sulfopropyl) disulfide (SPS) with a critical concentration suppresses the impurity incorporation and the void formation. In this article, relevant studies were reviewed, and the focus was placed on the effects of additive formula and plating parameters on the impurity incorporation in the electroplated Cu film, and the void formation in the solder joints.

show abstract

Section: Acceleratormentioning

confidence: 99%

Impurity Effects in Electroplated-Copper Solder Joints

Lee

Chen

2018

Metals

View full text Add to dashboard Cite

show abstract

“…[6,7] Acid sulfate copper electroplating has been the most commonly used technology in the PCB hole metallization. [8,9] The additives in the acid sulfate copper electroplating bath are categorized as the accelerator such as bis-(sodium sulfopropyl)-disulfide (SPS), the inhibitor such as polyethylene glycol (PEG), and the leveler such as Janus Green B (JGB). [10][11][12][13] The high concentration of sulfuric acid in the bath is corrosive.…”

Section: Introductionmentioning

confidence: 99%

“…Whereas, the obtained copper coating was in poor adhesion to its substrate, the bath was in low stability and the wastewater contained large quantities of phosphorus contaminant [6,7] . Acid sulfate copper electroplating has been the most commonly used technology in the PCB hole metallization [8,9] . The additives in the acid sulfate copper electroplating bath are categorized as the accelerator such as bis‐(sodium sulfopropyl)‐disulfide (SPS), the inhibitor such as polyethylene glycol (PEG), and the leveler such as Janus Green B (JGB) [10–13] .…”

Section: Introductionmentioning

confidence: 99%

Toward Preeminent Throwing Power from a Novel Alkaline Copper Electronic Electroplating Bath with Composite Coordination Agents

Jin

Yang

et al. 2022

ChemElectroChem

View full text Add to dashboard Cite

In this work, an electronic copper electroplating bath with low copper ion concentration and preeminent throwing power in through hole (TH) thickening of the printed circuit board (PCB) was successfully developed. Based upon the weak alkaline bath containing the composite complexants of citrate (Cit) and ethylenediamine (En), their synergistic effects on the preeminent bath throwing power were carefully investigated and theoretically proved. The UV‐vis spectroscopy results illustrated that En exhibited a stronger coordination ability with Cu (II) ion than citrate, and the stoichiometric coordination ratio between En and Cu (II) ion was 2 : 1. The linear sweep voltammetry (LSV) results showed that the electro‐reduction peak potential of Cit−Cu coordination ion was −0.55 V (vs. Hg/HgO), whereas that of En−Cu ion was at a more negative potential of −0.82 V. The in situ Fourier transform infrared (FTIR) spectroscopy revealed that the adsorptions of the Cit−Cu and En−Cu coordination ions were potential dependent on the copper electrode. The Cit−Cu coordination ion was easily adsorbed at the interior sites of through holes with lower over‐potential to promote the growth of copper coating. Moreover, the En−Cu coordination ion adsorbed preferably on the surface and the edge of through hole for its higher electro‐reduction overpotential, to hinder the germinating of copper nuclear. The cross‐section observation of optical microscope proved that the throwing power of novel copper electroplating bath behaved surpassingly, up to 105.8 %.

show abstract

“…In the development of HDI-PCBs integration, the aspect ratio of through holes increases significantly, where the aspect ratio (ε) is defined as the depth (D) of the hole divided by its width (W). In high aspect ratio plated through holes, the diffusion of the reactants would be constricted by the very narrow and deep holes, leading to the concentration polarizations of copper ions, which would impede the copper deposition process [6][7][8]. Although many strategies have been developed to address the above mentioned limitations [9][10][11][12], it is still challenging to realize uniform copper superfilling of the plating through a hole with high aspect ratio.…”

Section: Introductionmentioning

confidence: 99%

Ultra-Uniform Copper Deposition in High Aspect Ratio Plated through Holes via Pulse-Reverse Plating

Li³

et al. 2022

Coatings

View full text Add to dashboard Cite

The uniformity and microstructure of the copper deposition in the high aspect ratio plated through holes (penetrating holes) are crucial for the performance of printed circuit board. We systematically investigated the effects of reverse pulse parameters in the period pulse reverse (PPR) plating on the uniformity and microstructure of the copper deposition, including reverse pulse frequency, reverse pulse duty cycle and reverse pulse current density. The Cu deposition behavior (throwing power) and its crystallographic characteristics, including grain size, crystallographic orientation, and grain boundary, were characterized by means of field-emission scanning electron microscopy (FE-SEM), X-ray diffractometer (XRD), and electron backscatter diffraction (EBSD). Our results clarify that the reverse pulse current density and duty ratio should be low to achieve the full filling and high uniformity of the through holes. The reverse pulse frequency of 1500 Hz would prevent the through holes to be fully filled. The copper electrodeposition in PTH prepared by double pulse electrodeposition has the good (111) surface texture and grain boundary distribution. This work demonstrated that the period pulse reverse (PPR) plating provides unique advantages in achieving the ultra-uniform copper deposition in the high aspect ratio plated through holes.

show abstract

Effects of Brighteners in a Copper Plating Bath on Throwing Power and Thermal Reliability of Plated Through Holes

Cited by 42 publications

References 48 publications

Impurity Effects in Electroplated-Copper Solder Joints

Impurity Effects in Electroplated-Copper Solder Joints

Toward Preeminent Throwing Power from a Novel Alkaline Copper Electronic Electroplating Bath with Composite Coordination Agents

Ultra-Uniform Copper Deposition in High Aspect Ratio Plated through Holes via Pulse-Reverse Plating

Contact Info

Product

Resources

About