An advanced bottom electrode contact (BEC) was successfully developed for reliable high-density 256 Mb phase-change random access memory (PRAM) using a ring-type contact scheme. This advanced ring-type BEC was prepared by depositing very thin TiN films inside a contact hole, after which core dielectrics were uniformly filled into the TiN-deposited contact hole. Using this novel contact scheme, it was possible to reduce reset current while maintaining a low set resistance and a uniform cell distribution. Thus, it has been clearly demonstrated that the use of the ring-type contact technology is very feasible for high-density PRAM beyond 256 Mb.
Phase-change random access memory is considered a potential challenger for conventional memories, such as dynamic random access memory and flash memory due to its numerous advantages. Nevertheless, high reset current is the ultimate problem in developing high-density phase-change random access memory (PRAM). We focus on the adoption of Ge2Sb2Te5 confined structures to achieve lower reset currents. By changing from a normal to a GST confined structure, the reset current drops to as low as 0.8 mA. Eventually, our integrated 64 Mb PRAM based on 0.18 µm CMOS technology offers a large sensing margin: R
reset ∼200 kΩ and R
set ∼2 kΩ, as well as reasonable reliability: an endurance of 1.0×109 cycles and a retention time of 2 years at 85°C.
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