We present a design methodology and manufacturing process for the construction of articulated three-dimensional microstructures with features on the micron to centimeter scale. Flexure mechanisms and assembly folds result from the bulk machining and lamination of alternating rigid and compliant layers, similar to rigid-flex printed circuit board construction. Pop-up books and other forms of paper engineering inspire designs consisting of one complex part with a single assembly degree of freedom. Like an unopened pop-up book, mechanism links reside on multiple interconnected layers, reducing interference and allowing folding mechanisms of greater complexity than achievable with a single folding layer. Machined layers are aligned using dowel pins and bonded in parallel. Using mechanical alignment that persists during bonding allows device layers to be anisotropically pre-strained, a feature we exploit to create self-assembling structures. These methods and three example devices are presented.
This study demonstrates the patterning and growth of carbon nanotubes (CNTs) on a highly structured three-dimensional (3D) substrate surface and even underneath the suspended microstructure surface. Three key processes-plasma surface treatment, self-assembled monolayer (SAM) coating and contact displacement electroless (CDE) plating-are employed and integrated to implement the present concept. In application, the CNTs have been conformally grown and patterned on the highly structured 3D substrate surface containing 100 μm deep anisotropic etched cavities with 54.7 • as well as 90 • sidewalls. The integration of these 3D patterns of CNTs with suspended MEMS cantilevers has also been demonstrated. Moreover, the 'positive' and 'negative' pattern transformations of CNTs on the highly structured substrate surface and even underneath the suspended MEMS structure surface are successfully achieved. In addition, the 3D patterns of CNTs have also been successfully transferred onto flexible PDMS substrates.
This study presents a simple process to realize the lithography and deposition on a complicated three-dimensional ͑3D͒ substrate surface conformally. The 3D lithography and patterning on a highly structured surface is implemented using the self-assembled monolayer ͑SAM͒ coating and the plasma treatment. Moreover, the selective film deposition on a 3D surface and even underneath the suspended microstructures is realized using the contact displacement electroless plating. In applications, the Cu film was conformally plated and patterned on a Si substrate with 50-200 m deep cavities and 54.7-90°sidewalls. Moreover, the Cu electrode underneath suspended microbeams was also plated.
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