Tuning the shape and curvature of micromachined cantilevers using multiple plasma treatments

Su, Wang-Shen; Lee, Sheng-Ta; Lin, Cheng-Yu; Tsai, Ming-Shih; Yip, Ming‐Chuen; Fang, Weileun

doi:10.1016/j.sna.2005.11.010

Cited by 8 publications

(6 citation statements)

References 24 publications

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“…Moreover, using the combination of plasma treatments along beam width can also generate a flat cantilever. 24) 4. Conclusions…”

Section: Combination Of Two Nh 3 Plasma Treatmentsmentioning

confidence: 99%

“…The radius of the curvature of a 200-mmlong cantilever was 1.85 mm before plasma treatment, and In general, the thin-film equivalent gradient residual stresses can be modified by physical and chemical methods of plasma treatment. [23][24][25] For instance, ion bombardment is a well known physical effect, 23) whereas the formation of chemical bonds is a typical chemical approach. 24,25) In this study, the O 2 plasma treatment leads to a compressive residual stress on the surface, so that the equivalent gradient residual stress bent the cantilever concave downward.…”

Section: Treatment With Single Plasmamentioning

confidence: 99%

“…[23][24][25] For instance, ion bombardment is a well known physical effect, 23) whereas the formation of chemical bonds is a typical chemical approach. 24,25) In this study, the O 2 plasma treatment leads to a compressive residual stress on the surface, so that the equivalent gradient residual stress bent the cantilever concave downward. This compressive residual stress was predominated by ion bombardment (physical effect).…”

Section: Treatment With Single Plasmamentioning

confidence: 99%

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Modification of the Mechanical Properties of SiO₂ Thin Film Using Plasma Treatments for Micro-Electro-Mechanical Systems Applications

Huang

Fang

2008

jjap

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In this study, we developed a novel method of modifying thin-film mechanical properties by plasma surface modification. In order to demonstrate the feasibility of this approach, various plasma treatments, including exposure to O 2 , H 2 , and NH 3 atmospheres, were implemented to modify the mechanical properties, including Young's modulus, residual stress, and hardness, of SiO 2 films. The experimental results show that the mechanical properties have been changed following the formation of SiN and Si-H bonds. These characteristics can be employed to change the shape and resonant frequencies of micromachined beams for micro-electro-mechanical systems (MEMS) applications. Since plasma treatment is simple and easy to integrate with existing processes, it has the potential to be an efficient way to finely modify the mechanical characteristics of MEMS structures.

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“…Moreover, using the combination of plasma treatments along beam width can also generate a flat cantilever. 24) 4. Conclusions…”

Section: Combination Of Two Nh 3 Plasma Treatmentsmentioning

confidence: 99%

Section: Treatment With Single Plasmamentioning

confidence: 99%

Section: Treatment With Single Plasmamentioning

confidence: 99%

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Modification of the Mechanical Properties of SiO₂ Thin Film Using Plasma Treatments for Micro-Electro-Mechanical Systems Applications

Huang

Fang

2008

jjap

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“…The research studies underlying the role of cold plasma on shape change or bending are limited. Some of them include morphing the shape-change behavior of Dionaea muscipula (Venus flytrap) and Mimosa pudica L. plants (Volkov, Xu, & Kolobov, 2017), modifying the curvature and shape of SiO 2 cantilevers (Su et al, 2006), and improved bending of ionic polymer-metal composite (IPMC) actuators (Kim, Lee, & Kim, 2007). Recently, there has been an increase in the applications of cold plasma in food processing.…”

Section: Introductionmentioning

confidence: 99%

Cold plasma‐assisted shape‐shifting of a flat two‐dimensional wheat xerogel and its morphological behavior

Gupta

Kalaivendan

Stephen

et al. 2020

J Food Process Engineering

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This study aims at integrating food material with food processing to develop edible shape‐changing foods and investigate the effect of cold plasma treatment on their functionality. The anisotropic structure of the xerogel was obtained by sessile drop drying of the hydrogel. Xerogel discs were exposed to glow discharge plasma at 7.32 W for 5 min. For harnessing shape transformation, ethyl cellulose (constraint material) was applied in a single circle pattern. Upon immersing in hot water shape transformation takes place, and increases in bending curvature, angle, and height were observed for both the samples. The plasma treatment led to surface etching (ablation) of the xerogel. This resulted in better adhesion between constraint material and xerogel and therefore, more bending of plasma‐treated xerogel was observed than the untreated ones signifying a positive effect of cold plasma on shape transformation. Consequently, this method can be explored for the application in four‐dimensional food materials. Practical applications Designing flat two‐dimensional materials capable of undergoing shape transformation into a three‐dimensional configuration during cooking/frying, is an innovative area of research which could facilitate in reducing shipping and packaging costs as well as to engineer user‐customized interactive food materials. Detachment of constraint material from xerogel can be rectified by using cold plasma technique. This engineered shape transformation technique may help in food processing industries through the introduction of four‐dimensional printed food materials.

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“…1. The present process contains three key steps: ͑i͒ the plasma treatment, 9 ͑ii͒ the octadecyltrichlorosilane ͑OTS͒ self-assembled monolayer ͑SAM͒ coating, 10 and ͑iii͒ the contact displacement electroless ͑CDE͒ plating. 11 These techniques are employed to replace the conventional photolithography and film deposition processes on highly structured 3D surfaces.…”

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confidence: 99%

A Three-Dimensional Microfabrication Technology on Highly Structured Surfaces

Tsai

Fang

2007

Electrochem. Solid-State Lett.

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This study presents a simple process to realize the lithography and deposition on a complicated three-dimensional ͑3D͒ substrate surface conformally. The 3D lithography and patterning on a highly structured surface is implemented using the self-assembled monolayer ͑SAM͒ coating and the plasma treatment. Moreover, the selective film deposition on a 3D surface and even underneath the suspended microstructures is realized using the contact displacement electroless plating. In applications, the Cu film was conformally plated and patterned on a Si substrate with 50-200 m deep cavities and 54.7-90°sidewalls. Moreover, the Cu electrode underneath suspended microbeams was also plated.

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Tuning the shape and curvature of micromachined cantilevers using multiple plasma treatments

Cited by 8 publications

References 24 publications

Modification of the Mechanical Properties of SiO₂ Thin Film Using Plasma Treatments for Micro-Electro-Mechanical Systems Applications

Modification of the Mechanical Properties of SiO₂ Thin Film Using Plasma Treatments for Micro-Electro-Mechanical Systems Applications

Cold plasma‐assisted shape‐shifting of a flat two‐dimensional wheat xerogel and its morphological behavior

A Three-Dimensional Microfabrication Technology on Highly Structured Surfaces

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Tuning the shape and curvature of micromachined cantilevers using multiple plasma treatments

Cited by 8 publications

References 24 publications

Modification of the Mechanical Properties of SiO2 Thin Film Using Plasma Treatments for Micro-Electro-Mechanical Systems Applications

Modification of the Mechanical Properties of SiO2 Thin Film Using Plasma Treatments for Micro-Electro-Mechanical Systems Applications

Cold plasma‐assisted shape‐shifting of a flat two‐dimensional wheat xerogel and its morphological behavior

A Three-Dimensional Microfabrication Technology on Highly Structured Surfaces

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Product

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Modification of the Mechanical Properties of SiO₂ Thin Film Using Plasma Treatments for Micro-Electro-Mechanical Systems Applications

Modification of the Mechanical Properties of SiO₂ Thin Film Using Plasma Treatments for Micro-Electro-Mechanical Systems Applications