The design of a versatile high-precision eight-axis ultrahigh-vacuum-compatible polarimeter is presented. This multipurpose instrument can be used as a self-calibrating polarization detector for linearly and circularly polarized UV and soft-x-ray light. It can also be used for the characterization of reflection or transmission properties (reflectometer) or polarizing and phase-retarding properties (ellipsometer) of any optical element. The polarization properties of Mo/Si, Cr/C, Cr/Sc, and Ni/Ti multilayers used in this polarimeter as polarizers in transmission and as analyzers in reflection have been investigated theoretically and experimentally. In the soft-x-ray range, close to the p edges of Sc, Ti, and Cr, resonantly enhanced phase retardation of the transmission polarizers of as much as 18 degrees has been measured. With these newly developed optical elements the complete polarization analysis of soft-x-ray synchrotron radiation can be extended to the water-window range from 300 to 600 eV.
Structure sizes of approximately 180 nm are now standard in microelectronics, and state-of-the-art fabrication techniques can reduce these to just a few tens of nanometres. But at these length scales, the strain induced at interfaces can locally distort the crystal lattice, which may in turn affect device performance in an unpredictable way. A means of non-destructively characterizing such strain fields with high spatial resolution and sensitivity is therefore highly desirable. One approach is to use Raman spectroscopy, but this is limited by the intrinsic approximately 0.5-microm resolution limit of visible light probes. Techniques based on electron-beam diffraction can achieve the desired nanometre-scale resolution. But either they require complex sample preparation procedures (which may alter the original strain field) or they are sensitive to distortional (but not dilational) strain within only the top few tens of nanometres of the sample surface. X-rays, on the other hand, have a much greater penetration depth, but have not hitherto achieved strain analysis with sub-micrometre resolution. Here we describe a magnifying diffraction imaging procedure for X-rays which achieves a spatial resolution of 100nm in one dimension and a sensitivity of 10(-4) for relative lattice variations. We demonstrate the suitability of this procedure for strain analysis by measuring the strain depth profiles beneath oxidized lines on silicon crystals.
In this letter we present a hard x-ray phase contrast microscope based on the divergent and coherent beam exiting an x-ray waveguide. It uses lensless geometrical projection to magnify spatial variations in optical path length more than 700 times. Images of a nylon fiber and a gold test pattern were obtained with a resolution of 0.14 μm in one direction. Exposure times as short as 0.1 s gave already visible contrast, opening the way to high resolution, real time studies.
This report discusses the optimization strategy, the theoretical background and first experimental data of a new refractive lens for focusing X-rays. In order to reduce the absorption of X-rays in this transmission lens, optically passive material was removed from the necessarily concave lens shape in a highly regular pattern. The feature dimensions require lens production and replication by deep X-ray lithography, which allows shaping in only one dimension. Consequently such a lens can focus in one direction only, so a crossed lens pair is needed for two-dimensional focusing. The single lens is composed of two large prisms of millimetre size, which touch each other at one of the tips, like an old sand clock. Each large prism contains a highly regular structure of essentially identical prism-like smaller segments. The first lens prototypes focused an X-ray beam with a vertical size of 500 microm and a photon energy of 8 keV to a line with a width of only 2.8 microm. This is only slightly worse than the line width of 1.73 microm expected for its focal length of f = 2.18 m. The photon density enhancement in the focus was 25, but could have been larger as the lens can intercept a beam height of 2.6 mm.
This report discusses the properties of a 13-keV submicrometer x-ray beam exiting from a waveguide. Waveguides for this spectral regime can be constructed by enclosing a low-absorbing material between highly absorbant metals. Best performance is found for about 0.1 μm guiding layer thickness. Measurements of the photon beam size close to the exit and of the intensity distribution far from the exit will be presented. From these data one derives a beam size at the exit which is identical to the guiding layer thickness. This number being in the submicrometer range offers interesting perspectives for microscopy experiments in the hard x-ray range.
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