Rubidium (Rb) is explored as an alternative cation to use in a novel multication method with the formamidinium/methylammonium/cesium (Cs) system to obtain 1.73 eV bangap perovskite cells with negligible hysteresis and steady state efficiency as high as 17.4%. The study shows the beneficial effect of Rb in improving the crystallinity and suppressing defect migration in the perovskite material. The light stability of the cells examined under continuous illumination of 12 h is improved upon the addition of Cs and Rb. After several cycles of 12 h light–dark, the cell retains 90% of its initial efficiency. In parallel, sputtered transparent conducting oxide thin films are developed to be used as both rear and front transparent contacts on quartz substrate with less than 5% parasitic absorption of near infrared wavelengths. Using these developments, semi‐transparent perovskite cells are fabricated with steady state efficiency of up to 16.0% and excellent average transparency of ≈84% between 720 and 1100 nm. In a tandem configuration using a 23.9% silicon cell, 26.4% efficiency (10.4% from the silicon cell) in a mechanically stacked tandem configuration is demonstrated which is very close to the current record for a single junction silicon cell of 26.6%.

The interdigitated back contact (IBC) solar cells developed at the Australian National University have resulted in an independently confirmed (Fraunhofer Institut für Solare Energiesysteme (ISE) CalLab) designated‐area efficiency of 24.4 ± 0.7%, featuring short‐circuit current density of 41.95 mA/cm2, open‐circuit voltage of 703 mV and 82.7% fill factor. The cell, 2 × 2 cm2 in area, was fabricated on a 230 µm thick 1.5 Ω cm n‐type Czochralski wafer, utilising plasma‐enhanced chemical vapour deposition (CVD) SiNx front‐surface passivation without front‐surface diffusion, rear‐side thermal oxide/low‐pressure CVD Si3N4 passivation stack and evaporated aluminium contacts with a finger‐to‐finger pitch of 500 µm. This paper describes the design and fabrication of lab‐scale high‐efficiency IBC cells. Characterisation of optical and electronic properties of the best produced cell is made, with subsequent incorporation into 3D device modelling used to accurately quantify all losses. Loss analysis demonstrates that bulk and emitter recombination, bulk resistive and optical losses are dominant and suggests a clear route to efficiency values in excess of 25%. Additionally, laser processing is explored as a means to simplify the manufacture of IBC cells, with a confirmed efficiency value of 23.5% recorded for cells fabricated using damage‐free deep UV laser ablation for contact formation. Meanwhile all‐laser‐doped cells, where every doping and patterning step is performed by lasers, are demonstrated with a preliminary result of 19.1% conversion efficiency recorded. Copyright © 2014 John Wiley & Sons, Ltd.

Mixed‐dimensional perovskite solar cells combining 3D and 2D perovskites have recently attracted wide interest owing to improved device efficiency and stability. Yet, it remains unclear which method of combining 3D and 2D perovskites works best to obtain a mixed‐dimensional system with the advantages of both types. To address this, different strategies of combining 2D perovskites with a 3D perovskite are investigated, namely surface coating and bulk incorporation. It is found that through surface coating with different aliphatic alkylammonium bulky cations, a Ruddlesden–Popper “quasi‐2D” perovskite phase is formed on the surface of the 3D perovskite that passivates the surface defects and significantly improves the device performance. In contrast, incorporating those bulky cations into the bulk induces the formation of the pure 2D perovskite phase throughout the bulk of the 3D perovskite, which negatively affects the crystallinity and electronic structure of the 3D perovskite framework and reduces the device performance. Using the surface‐coating strategy with n‐butylammonium bromide to fabricate semitransparent perovskite cells and combining with silicon cells in four‐terminal tandem configuration, 27.7% tandem efficiency with interdigitated back contact silicon bottom cells (size‐unmatched) and 26.2% with passivated emitter with rear locally diffused silicon bottom cells is achieved in a 1 cm2 size‐matched tandem.

Free carrier absorption in heavily doped silicon can have a significant impact on devices operating in the infrared. In the near infrared, the free carrier absorption process can compete with band to band absorption processes, thereby reducing the number of available photons to optoelectronic devices such as solar cells. In this work, we fabricate 18 heavily doped regions by phosphorus and boron diffusion into planar polished silicon wafers; the simple sample structure facilitates accurate and precise measurement of the free carrier absorptance. We measure and model reflectance and transmittance dispersion to arrive at a parameterisation for the free carrier absorption coefficient that applies in the wavelength range between 1000 and 1500 nm, and the range of dopant densities between $10 18 and 3 Â 10 20 cm À3. Our measurements indicate that previously published parameterisations underestimate the free carrier absorptance in phosphorus diffusions. On the other hand, published parameterisations are generally consistent with our measurements and model for boron diffusions. Our new model is the first to be assigned uncertainty and is well-suited to routine device analysis. V

The reduction of parasitic recombination processes commonly occurring within the silicon crystal and at its surfaces is of primary importance in crystalline silicon devices, particularly in photovoltaics. Here we explore a simple, room temperature treatment, involving a nonaqueous solution of the superacid bis(trifluoromethane)sulfonimide, to temporarily deactivate recombination centers at the surface. We show that this treatment leads to a significant enhancement in optoelectronic properties of the silicon wafer, attaining a level of surface passivation in line with state-of-the-art dielectric passivation films. Finally, we demonstrate its advantage as a bulk lifetime and process cleanliness monitor, establishing its compatibility with large area photoluminescence imaging in the process.

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A silicon dioxide (SiO 2) electret passivates the surface of crystalline silicon (Si) in two ways: (i) when annealed and hydrogenated, the SiO 2-Si interface has a low density of interface states, offering few energy levels through which electrons and holes can recombine; and (ii) the electret's quasipermanent charge repels carriers of the same polarity, preventing most from reaching the SiO 2-Si interface and thereby limiting interface recombination. In this work, we engineer a charged thermal SiO 2 electret on Si by depositing corona charge onto the surface of an oxide-coated Si wafer and subjecting the wafer to a rapid thermal anneal (RTA). We show that the surface-located corona charge is redistributed deeper into the oxide by the RTA. With 80 s of charging, and an RTA at 380 C for 60 s, we measure an electret charge density of 5 Â 10 12 cm-2 , above which no further benefit to surface passivation is attained. The procedure leads to a surface recombination velocity of less than 20 cm/s on 1 X-cm n-type Si, which is commensurate with the best passivation schemes employed on high-efficiency Si solar cells. In this paper, we introduce the method of SiO 2 electret formation, analyze the relationship between charge density and interface recombination, and assess the redistribution of charge by the RTA. V