The present study disclosed that free-carrier absorption (FCA) activated by 1310-nm laser irradiation caused a distinct effect on the formation of nanocrystals in the porous layer of p ++ silicon with the anodization less than 10 minutes. Under ultraviolet excitation, the photoluminescence peak locations are quite different in the irradiated spot (∼535 nm) and in the normal porous silicon (∼640 nm). In the irradiated spot, the intensity of the photoluminescence is at least 10 times higher than that of the peripheral porous silicon layer. This shows that the FCA effect provides an alternative way to produce dense and uniform nanocrystals. Electrochemical processing 1 has been the most common way to produce nanostructures, e.g., as a porous silicon layer, in a silicon substrate for many unique applications. [2][3][4][5] In the structure of porous silicon, the diameter of the pore walls in tens of nanometers sharp nanocrystals with one-or two-dimensional quantum confinement [6][7][8] that can be used for constructing devices of silicon lighting.By adopting the anodization model of porous silicon formation in a hydrofluoric acid (HF)-based electrolyte, 6 we obtain the following:Obviously, holes play a dominant role in the dissolution of silicon, which allows us to modify the porous structure directly by adjusting the current density, dopant/electrolyte concentration, and processing time. Controlling the number of holes by applying an appropriate illumination, 9-11 the silicon atoms that dissolved on the bulk surface immersed in electrolyte could create a three-dimensional coralline-like structure filled with nanocrystals during anodization. These nanocrystals display the characteristics of quantum confinement with the behavior of photoluminescence for detection. Here, we demonstrate that the free-carrier absorption (FCA) produced by irradiation with a long-wavelength laser (>1100 nm) can modify the formation of p-type porous silicon in anodization.The materials used were boron-doped and phosphorus-doped (100) silicon prime wafers (cut into 5 × 5 cm 2 ) with two resistivities: 1 to 10 cm (p-and n-specimens) and 0.001 to 0.005 cm (p ++ and n ++ specimens). Prior to anodization, all silicon specimens were cleaned using solutions of NH 4 OH:H 2 O 2 :H 2 O = 1:1:5 and HCl:H 2 O 2 :H 2 O = 1:1:6, and then dipped into 1% HF for several seconds to remove native surface oxide. Electrochemical anodization was performed at a constant current density of 10 mA/cm 2 with a platinum cathode in the electrolyte (a mixture of 49.5% HF and 99.5% ethanol at 1:1 volume ratio). During anodization, we used a laser system equipped with a 1310 nm laser drive (max power = 7.0 mW) to create a 1.0-mm diameter light spot on the surface of the specimens.In the anodization of n-type silicon, illumination that produces photogenerated holes 12,13 is a way to carry out electrochemical etching. However, for p-type silicon, the effect of illumination is the opposite: inhibiting the formation of porous silicon 5,9,10,14 because of photogenerated electr...