Tahara Shigeru scite author profile

In this paper we report on the patterning challenges for the integration of Spin-Transfer Torque Magneto-ResistiveRandom-Access Memory (STT MRAM). An overview of the different patterning approaches that have been evaluated in the past decade is presented. Plasma based etching, wet echting, but also none subtractive pattering approaches are covered. The paper also reports on the patterning strategies, currently under investigation at imec.

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28 nm pitch of line/space pattern transfer into silicon substrates with chemo-epitaxy Directed Self-Assembly (DSA) process flow

Chan

Shigeru

Parnell³

et al. 2014

Microelectronic Engineering

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Tahara Shigeru

Advances in directed self assembly integration and manufacturability at 300 mm

Progress in directed self-assembly hole shrink applications

STT MRAM patterning challenges

28 nm pitch of line/space pattern transfer into silicon substrates with chemo-epitaxy Directed Self-Assembly (DSA) process flow

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