I I53 -ANALYTICAL 0 B.E.M. E h. . i 8 eo Distance across chip (cm.) Fig. 5. Thermal profile over the chip surface. The chip and package lateral dimensions are the same: 50 mil X 50 mil.using both the BEM and the corresponding analytical solutions. It was shown that the agreement between BEM and the analytical solutions is excellent. The most appealing feature of BEM is the simplicity and ease of data preparation coupled with the fact that it admits discontinuous shape functions for its (boundary) elements. This provides the engineer an invaluable tool for determining the regions in the device model where the mesh needs further refinement. As to the accuracy of the method, it must be pointed out that the method models the boundary value problem exactly within the domain. Errors are introduced only because we are not able to perform the integrations in closed form but must resort to brute force numerical techniques.
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