Teaching engineering design through senior project or capstone engineering courses has increased in recent years. The trend toward increasing the design component in engineering curricula is part of an effort to better prepare graduates for engineering practice. This paper describes the standard practices and current state of capstone design education throughout the country as revealed through a literature search of over 100 papers relating to engineering design courses. Major topics include the development of capstone design courses, course descriptions, project information, details of industrial involvement, and special aspects of team‐oriented design projects. An extensive list of references is provided.
Senior project or Capstone‐type courses have existed at engineering schools for many years. Capstone courses provide student engineers the opportunity to solve real‐world engineering projects, and have been highly regarded as important learning activities. A survey of Capstone courses in engineering departments throughout North America was conducted in order to understand current practices in Capstone education. This study was conducted for presentation at the 1994 Advances in Capstone Education Conference, held at Brigham Young University, which brought together engineering educators interested in improving Capstone experiences. This conference was sponsored by ASEE, ASME, SME, and NSF. Response to the study was very high, with 360 departments from 173 schools responding to the survey. Survey results were categorized into five major areas of interest: Profile of the Respondents, Course Description Information, Faculty Involvement in Capstone Education, Project Information, and Industrial Involvement in Capstone Education. Graphs provide the results of responses to survey questions.
The purpose of this work is to develop approaches to accommodate thickness in origami-based deployable arrays with a high ratio of deployed-to-stowed diameter. The origami flasher model serves as a basis for demonstrating the approach. A thickness-accommodating mathematical model is developed to describe the flasher. Practical modifications are presented for the creation of physical models and two options are proposed: allowing the panels to fold along their diagonals or applying a membrane backing with specified widths at fold-lines. The mathematical model and hardware modifications are employed to create several physical models. The results are general and apply to a range of applications. An example is provided by the application that motivated the work: a deployable solar array for space applications. The model is demonstrated in hardware as a 1/20th scale prototype with a ratio of deployed-to-stowed diameter of 9.2 (or 1.25 m deployed outer diameter to 0.136 m stowed outer diameter).
The origami waterbomb base is a single-vertex bistable origami mechanism that has unique properties which may prove useful in a variety of applications. It also shows promise as a test bed for smart materials and actuation because of its straightforward geometry and multiple phases of motion, ranging from simple to more complex. This study develops a quantitative understanding of the symmetric waterbomb baseʼs kinetic behavior. This is done by completing kinematic and potential energy analyses to understand and predict bistable behavior. A physical prototype is constructed and tested to validate the results of the analyses. Finite element and virtual work analyses based on the prototype are used to explore the locations of the stable equilibrium positions and the force–deflection response. The model results are verified through comparisons to measurements on a physical prototype. The resulting models describe waterbomb base behavior and provide an engineering tool for application development.
It is sometimes forgotten that industry is an important customer of engineering education. Ignoring this relationship has produced graduates that often fail to meet the changing needs of industry in todays competitive environment. On the basis of feedback from our industrial customers, faculty from Mechanical Engineering and Manufacturing Engineering at Brigham Young University have jointly developed a new senior capstone design course entitled Integrated Product and Process Design. This new capstone course is centered on industrial design and manufacturing projects. These projects involve both product and process design activities. Multidisciplinary teams of students are taught a structured development approach to produce typical industrial deliverables. These deliverables include a functional specification, product and process design, prototype, and first production sample. This paper identifies changing industrial needs, describes how the course was designed to meet these needs, and presents results from the initial offerings of the course.
The purpose of this work is to create deployment systems with a large ratio of stowed-to-deployed diameter. Deployment from a compact form to a final flat state can be achieved through origami-inspired folding of panels. There are many models capable of this motion when folded in a material with negligible thickness; however, when the application requires the folding of thick, rigid panels, attention must be paid to the effect of material thickness not only on the final folded state, but also during the folding motion (i.e., the panels must not be required to flex to attain the final folded form). The objective is to develop new methods for deployment from a compact folded form to a large circular array (or other final form). This paper describes a mathematical model for modifying the pattern to accommodate material thickness in the context of the design, modeling, and testing of a deployable system inspired by an origami six-sided flasher model. The model is demonstrated in hardware as a 1/20th scale prototype of a deployable solar array for space applications. The resulting prototype has a ratio of stowed-to-deployed diameter of 9.2 (or 1.25 m deployed outer diameter to 0.136 m stowed outer diameter).
Rigidly foldable origami allows for motion where all deflection occurs at the crease lines and facilitates the application of origami in materials other than paper. In this paper, we use a recently discovered method for determining rigid foldability to identify existing flat-foldable rigidly foldable tessellations, which are also categorized. We introduce rigidly foldable origami gadgets which may be used to modify existing tessellations or to create new tessellations. Several modified and new rigidly foldable tessellations are presented.
The Direct Linearization Method (DLM) for tolerance analysis of 3-D mechanical assemblies is presented. Vector assembly models are used, based on 3-D vector loops which represent the dimensional chains that produce tolerance stackup in an assembly.Tolerance analysis procedures are formulated for both open and closed loop assembly models. The method generalizes assembly variation models to include small kinematic adjustments between mating parts.Open vector loops describe critical assembly features. Closed vector loops describe kinematic constraints for an assembly. They result in a set of algebraic equations which are implicit functions of the resultant assembly dimensions. A general linearization procedure is outlined, by which the variation of assembly parameters may be estimated explicitly by matrix algebra.Solutions to an over-determined system or a system having more equations than unknowns are included. A detailed example is presented to demonstrate the procedures of applying the DLM to a 3-D mechanical assembly.
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