Articles you may be interested inSchottky-barrier lowering in silicon nanowire field-effect transistors prepared by metal-assisted chemical etching Appl. Phys. Lett. 98, 102113 (2011); 10.1063/1.3565971 Hydrogenated amorphous silicon nanowire transistors with Schottky barrier source/drain junctions Appl. Phys. Lett. 97, 143509 (2010); 10.1063/1.3499288 Contact mechanisms and design principles for (Schottky and Ohmic) metal contacts to semiconductor nanowires Arrays of Ni nanowire/multiwalled carbon nanotube/amorphous carbon nanotube heterojunctions containing Schottky contacts Appl. Phys. Lett. 90, 033114 (2007);Schottky contacts to n-type silicon nanowires were fabricated using Ni or nickel silicide contacts in a wraparound or end contact geometry, respectively. Series resistance in the test structures was reduced by heavily doping the opposite end of the silicon nanowire, facilitating Ohmic contact formation and reducing the resistance of the nanowire itself. The effective Schottky barrier height is reported as a function of nanowire doping, ambient, and applied back gate bias, highlighting some of the important variables affecting current transport in Schottky contacts to semiconductor nanowires. For the silicide contact to the most lightly doped silicon nanowire, measurements in N 2 showed that the effective barrier height without a back gate bias was 0.69 eV, and the ideality factor was 1.1.
The multiple-zone junction termination extension (MJTE) is a widely used SiC edge termination technique that reduces sensitivity to implantation dose variations. It is typically implemented in multiple lithography and implantation events. To reduce process complexity, cycle time, and cost, a single photolithography/implantation (P/I) MJTE technique was developed and diodes with 3-zone and 120-zone JTEs were fabricated on the same wafer. Here, the process tolerance of the single (P/I) MJTE technique is evaluated by performing CCD monitored blocking voltage measurements on diodes from the same wafer with the 3-zone and 120-zone single (P/I) JTE. The 3-zone JTE diodes exhibited catastrophic localized avalanches at the interface between the 2nd and 3rd zones due to abrupt zone transitions. Diodes with the smooth transitioning 120-zone JTE exhibited no CCD detectable avalanches in their JTE regions up to the testing limit of 12 kV. Under thick dielectric (deposited for on-wafer diode interconnection), diodes with the single P/I 3-zone JTE failed due to significant loss of high-voltage capability, while their 120-zone JTE diode counterparts were minimally affected. Overall, the single (P/I) 120-zone JTE provides a process-tolerant and robust single P/I edge termination at no additional fabrication labor.
The multi-zone junction termination extension (MJTE) is a widely used edge termination technique for achieving high voltage SiC devices. It is commonly implemented with multiple lithography and implantation events. In order to reduce process complexity, cycle time, and cost, a single photolithography and single implant MJTE technique has been successfully developed. The method utilizes a pattern of finely graduated oxide windows that filter the implant dose and create a graded MJTE in a single implant and single photolithography step. Based on this technique, 6 kV / 0.09 cm2 PiN diodes were fabricated utilizing a 120-zone single-implant JTE design. This novel single-implant MJTE design captures 93% of the ideal breakdown voltage and has comparable performance and yield to a baseline three implant process.
scite is a Brooklyn-based organization that helps researchers better discover and understand research articles through Smart Citations–citations that display the context of the citation and describe whether the article provides supporting or contrasting evidence. scite is used by students and researchers from around the world and is funded in part by the National Science Foundation and the National Institute on Drug Abuse of the National Institutes of Health.