We demonstrate quantum cascade lasers emitting at wavelengths of 3–3.2 μm in the InP-based material system. The laser core consists of GaInAs/AlInAs using strain balancing technique. In room temperature pulsed mode operation, threshold current densities of 1.66 kA/cm2 and 1.97 kA/cm2, and characteristic temperatures (T0) of 108 K and 102 K, are obtained for the devices emitting at 3.2 μm and 3 μm, respectively. Room temperature continuous wave operation is achieved at both wavelengths.
A dual-section, single-mode quantum cascade laser is demonstrated in continuous wave at room temperature with up to 114 nm (50 cm−1) of tuning near a wavelength of 4.8 μm. Power above 100 mW is demonstrated, with a mean side mode suppression ratio of 24 dB. By changing the grating period, 270 nm (120 cm−1) of gap-free electrical tuning for a single gain medium has been realized.
The viability of thin 4H-SiC membrane X-ray beam position monitors in synchrotrons is investigated. Devices are fabricated and show improved linearity, dynamics and signal-to-noise ratio compared with commercial polycrystalline diamond X-ray beam position monitors.
Abstract:In this article we present our latest work on the optimization of mid-infrared quantum cascade laser fabrication techniques. Our efforts are focused on low dissipation devices, broad-area high-power photonic crystal lasers, as well as multi-wavelength devices realized either as arrays or multi-section distributed feedback (DFB) devices. We summarize our latest achievements and update them with our most recent results.
The phenomenon of reduced energy capability of power metal-oxide-semiconductor fieldeffect transistors (MOSFETs) at high avalanche currents is investigated in commercial 1.2-kV 4H-SiC MOSFETs. Unclamped inductive switching (UIS) measurements as well as electrical transport simulations are used to identify the current paths and maximum avalanche currents, providing insight into the design limits. The investigated devices show a reduced energy capability for avalanche current above 52 A due to the latching of the parasitic bipolar junction transistor (BJT). The BJT also limits the maximum switchable current to ≤102 A. Based on the measurements and simulations, a procedure utilizing UIS measurements for identification of design limits is presented.
This paper presents an insight into the short circuit (SC) capability of Rohm’s discrete 1.2 kV, 80 mΩ state-of-the-art silicon carbide (SiC) double trench metal-oxide-semiconductor field effect transistor (MOSFET). SC measurements are performed to compare the behavior of Wolfspeed’s similarly rated 1.2 kV, 80 mΩ planar MOSFET with the Rohm trench devices. Short circuit withstand time (SCWT) of both designs under nominal operating conditions at room temperature is measured by performing destructive SC tests.
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