The quantum Hall effect allows the international standard for resistance to be defined in terms of the electron charge and Planck's constant alone. The effect comprises the quantization of the Hall resistance in two-dimensional electron systems in rational fractions of R(K) = h/e(2) = 25,812.807557(18) Omega, the resistance quantum. Despite 30 years of research into the quantum Hall effect, the level of precision necessary for metrology--a few parts per billion--has been achieved only in silicon and iii-v heterostructure devices. Graphene should, in principle, be an ideal material for a quantum resistance standard, because it is inherently two-dimensional and its discrete electron energy levels in a magnetic field (the Landau levels) are widely spaced. However, the precisions demonstrated so far have been lower than one part per million. Here, we report a quantum Hall resistance quantization accuracy of three parts per billion in monolayer epitaxial graphene at 300 mK, four orders of magnitude better than previously reported. Moreover, by demonstrating the structural integrity and uniformity of graphene over hundreds of micrometres, as well as reproducible mobility and carrier concentrations across a half-centimetre wafer, these results boost the prospects of using epitaxial graphene in applications beyond quantum metrology.

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In this work, Ru wires patterning by direct etch are evaluated for a potential 5 nm technology node. The characteristics of Ru etching by varying the bias voltage, total flow rate and Cl2/(O2+Cl2) gas flow ratio are studied in an inductively couple plasma etching chamber. Ru sidewalls profile with a tapering angle of 90° and Ru to SiO2 hard mask etch selectivity of 6 are achieved. The authors show the feasibility of patterning lines with an aspect ratio up to 3.5 and lines with a critical dimension down to 10.5 nm (with a 3σ line width roughness of 4.2 nm), which paves the way to further scaling of this approach. Finally, the authors present a study on Ru line roughness after patterning on 300 mm wafers. Here, they compare line roughness results of wafers where Ru is deposited with different deposition techniques, such as atomic layer deposition and plasma vapor deposition, and it is annealed after deposition at various temperatures.

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Quantitatively accurate, physics-based, computational modeling of etching and lithography processes is essential for modern semiconductor manufacturing. This paper presents lithography and etch models for a trilayer process in a back end of the line manufacturing vehicle. These models are calibrated and verified against top-down scanning electron microscope (SEM) and cross-sectional SEM measurements. Calibration errors are within 2 nm, while the maximum verification error is less than 3 nm. A fluorocarbon plasma etch of the spin-on-glass (SOG) layer accounts for most of the etch bias present in the process. The tapered profile in the SOG etch step is generated due to the polymerization process by fluorocarbon radicals generated in the plasma. The model predicts a strong correlation between the etch bias in the SOG etch step and the neutral-to-ion flux ratio in the plasma. The second etch step of the flow, which etches the spin-on-carbon (SOC) layer using an H2/N2 plasma, results in a negative etch bias (increase in CDs) for all measured features. The ratio of hydrogen to nitrogen radical fluxes effectively controls the etch bias in this step, with the model predicting an increase in the etch bias from negative to positive values as the H-to-N ratio decreases. The model also indicates an aspect ratio dependent etch rate in the SOG and SOC etch steps, as seen in the etch front evolution in a three-dimensional test feature. The third and final step of the process, SiO2-etch, generates an insignificant etch bias in all the test structures. Finally, the accuracy of the etch simulations is shown to be dependent on the accuracy of the incoming photoresist shapes. Models that consider only the top-down SEM measurement as input and do not account for an accurate photoresist profile, suffered significant errors in the post-etch CD predictions.