The quantum Hall effect allows the international standard for resistance to be defined in terms of the electron charge and Planck's constant alone. The effect comprises the quantization of the Hall resistance in two-dimensional electron systems in rational fractions of R(K) = h/e(2) = 25,812.807557(18) Omega, the resistance quantum. Despite 30 years of research into the quantum Hall effect, the level of precision necessary for metrology--a few parts per billion--has been achieved only in silicon and iii-v heterostructure devices. Graphene should, in principle, be an ideal material for a quantum resistance standard, because it is inherently two-dimensional and its discrete electron energy levels in a magnetic field (the Landau levels) are widely spaced. However, the precisions demonstrated so far have been lower than one part per million. Here, we report a quantum Hall resistance quantization accuracy of three parts per billion in monolayer epitaxial graphene at 300 mK, four orders of magnitude better than previously reported. Moreover, by demonstrating the structural integrity and uniformity of graphene over hundreds of micrometres, as well as reproducible mobility and carrier concentrations across a half-centimetre wafer, these results boost the prospects of using epitaxial graphene in applications beyond quantum metrology.
In this work, Ru wires patterning by direct etch are evaluated for a potential 5 nm technology node. The characteristics of Ru etching by varying the bias voltage, total flow rate and Cl2/(O2+Cl2) gas flow ratio are studied in an inductively couple plasma etching chamber. Ru sidewalls profile with a tapering angle of 90° and Ru to SiO2 hard mask etch selectivity of 6 are achieved. The authors show the feasibility of patterning lines with an aspect ratio up to 3.5 and lines with a critical dimension down to 10.5 nm (with a 3σ line width roughness of 4.2 nm), which paves the way to further scaling of this approach. Finally, the authors present a study on Ru line roughness after patterning on 300 mm wafers. Here, they compare line roughness results of wafers where Ru is deposited with different deposition techniques, such as atomic layer deposition and plasma vapor deposition, and it is annealed after deposition at various temperatures.
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