Nanocrystalline diamond (NCD) has been grown using a nanodiamond seeding technique, leading to a dense form of this material, with grain sizes around 100 nm. The electrical properties of both intrinsic and lightly boron-doped NCD have been investigated using impedance spectroscopy and Hall effect measurements. For intrinsic material, both grain boundaries and grains themselves initially contribute to the frequency dependant impedance values recorded. However, boundary conduction can be removed and the films become highly resistive. Interestingly, the ac properties of these films are also excellent with a dielectric loss value ∼0.004 for frequencies up to 10 MHz. The dielectric properties of these NCD films are therefore as good as high quality large grain polycrystalline diamond films. In the case of boron-doped material, p-type material with good carrier mobility values (10–50 cm2/V s) can be produced at carrier concentrations around 1017 cm−3.
The use of diamond as a semiconductor for the realization of transistor structures, which can operate at high temperatures (>700 K), is of increasing interest. In terms of bipolar devices, the growth of n-type phosphorus doped diamond is more efficient on the (111) growth plane; p-type boron-doped diamond growth has been most usually grown in the (100) direction and, hence, this study into the electronic properties, at high temperatures, of boron-doped diamond (111) homoepitaxial layers. It is shown that highly doped layers (hole carrier concentrations as high as 2×1020 cm−3) can be produced without promoting the onset of (unwanted) hopping conduction. The persistence of valance-band conduction in these films enables relatively high mobility values to be measured (∼20 cm2/V s) and, intriguingly, these values are not significantly reduced at high temperatures. The layers also display very low compensation levels, a fact that may explain the high mobility values since compensation is required for hopping conduction. The results are discussed in terms of the potential of these types of layers for use with high temperature compatible diamond transistors.
Impedance spectroscopy has been used to investigate conductivity within boron-doped diamond in an intrinsic/delta-doped/intrinsic (i-δ-i) multilayer structure. For a 5 nm thick delta layer, three conduction pathways are observed, which can be assigned to transport within the delta layer and to two differing conduction paths in the i-layers adjoining the delta layer. For transport in the i-layers, thermal trapping/detrapping processes can be observed, and only at the highest temperature investigated (673 K) can transport due to a single conduction process be seen. Impedance spectroscopy is an ideal nondestructive tool for investigating the electrical characteristics of complex diamond structures.
Nanocrystalline diamond (NCD) has been grown on oxide coated silicon wafers by microwave plasma assisted chemical vapour deposition using a novel seeding technique followed by optimised growth conditions, and leads to a highly-dense form of this material with grain sizes around 100nm for films approximately 1.5 microns thick. The electrical properties of these films have been investigated using Impedance Spectroscopy, which enables the contributions from sources characterised by differing capacitances, such as grain boundaries and grain interiors, to be isolated. After an initial acid clean the electrical properties of the film are not stable, and both grain boundaries and grains themselves contribute to the frequency dependant impedance values recorded. However, following mild oxidation grain boundary conduction is completely removed and the films become highly resistive (>1013 ohm/sq). This is most unusual, as conduction through NCD material is more normally dominated by grain boundary effects. Interestingly, the AC properties of these films are also excellent with a dielectric loss value (tan δ) as low as 0.002 for frequencies up to 10MHz. The dielectric properties of these NCD films are therefore as good as high quality free-standing (large grain) polycrystalline diamond films, and not too dissimilar to single crystal diamond, and are therefore ideally suited to future ‘silicon-on-diamond’ applications.
Impedance spectroscopy has been used to investigate the conductivity displayed by diamond doped with boron in an intrinsic-δ-layer-intrinsic multilayer system with differing δ-layer thicknesses. Carrier transport within 5 nm δ-layer structures is complex, being dominated by conduction in the interfacial regions between the δ-layer and the intrinsic regions, as well as conduction within the δ-layer itself. In the case of 3.2 nm thick δ-layers the situation appears improved with uncapped samples supporting only two conduction paths, one of which may be associated with transport outside of the δ-layer, the other low transport within the δ-layer complex diamond structures. Introduction of the capping layer creates a third conduction path associated with unwanted boron in the capping layer-δ-layer interface.
Abstractβ-Ga2O3 thin films with both a 45 nm Si-doped conductive epilayer and unintentionally doped epilayer were grown on c-plane sapphire substrate by metalorganic chemical vapor deposition. β-Ga2O3 based metal–oxide–semiconductor field-effect transistors (MOSFETs) were fabricated with gate recess depths of 20 nm and 40 nm (it indicated gate depth with 70 nm and 50 nm, respective), respectively, and without said recessing process. The conductivity of β-Ga2O3 epilayers was improved through low in situ doping using a tetraethoxysilane precursor to increase MOSFET forward current density. After recessing, MOSFET operation was transferred from depletion to enhanced mode. In this study, the maximum breakdown voltage of the recessed 40 nm transistor was 770 V. The etching depth of a recessed-gate device demonstrates its influence on device electrical performance.
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