Calculations of stress enhanced mobilities are performed for n-and p-FinFETs with both Si and Ge channels for the 14 nm node and beyond. Relaxed Ge p-FinFETs and even Ge with a GeSn5% source / drain stressor cannot outperform strained Si. However, growing the Ge channel strained on a SiGe75% strain relaxed buffer (SRB) provides a 49% mobility boost over strained Si. For Si n-FinFETs, SRB mobility boost is also possible, with Si on a SiGe 25% SRB improving mobility by 83%. Addition of a Si:C 2% S/D stressor increases that benefit to 109%. For Ge n-FinFETs, relaxed channels outperform strained Si by 120%, owing primarily to the 6× increase in fin sidewall mobility. Adding a SiGe 75% S/D stressor increases that benefit to 210%. In general, the SRB stressors have excellent scalability to future nodes. TCAD trends are qualitatively confirmed by Nano-Beam Diffraction.
Frequency-dependent complex conductivity of high-mobility GaAs and InAs two-dimensional-electron-gas (2DEG) systems is studied by terahertz time domain spectroscopy. Determining the momentum relaxation time from a Drude model, the authors find a lower value than that from dc measurements, particularly at high frequencies/low temperatures. These deviations are consistent with the ratio τt∕τq, where τq is the full scattering time. This suggests that small-angle scattering leads to weaker heating of 2DEGs at low temperatures than expected from dc mobility.
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