Quantum imaging is a multifaceted field of research that promises highly efficient imaging in extreme spectral ranges as well as ultralow‐light microscopy. Since the first proof‐of‐concept experiments over 30 years ago, the field has evolved from highly fascinating academic research to the verge of demonstrating practical technological enhancements in imaging and microscopy. Here, the aim is to give researchers from outside the quantum optical community, in particular those applying imaging technology, an overview of several promising quantum imaging approaches and evaluate both the quantum benefit and the prospects for practical usage in the near future. Several use case scenarios are discussed and a careful analysis of related technology requirements and necessary developments toward practical and commercial application is provided.

Experiments show the performance of quantum holography using undetected photons.

Imaging and microscopy are some of the most important tools in modern life science for getting new insights into metabolisms or unravelling bio‐chemical processes. However, in particular low‐light observations outside the visible spectrum are still challenging and a limiting factor. A rugged, label‐free quantum imaging system is presented capable of recording at video rate in the visible regime, while illuminating the sample with undetected light of different wavelength. The results pave the way for a field deployable quantum imaging device allowing live‐cell imaging in extreme spectral ranges with a minimal photo dose.

A miniaturized diode-pumped solid-state laser (DPSSL) designed as part of the Raman laser spectrometer (RLS) instrument for the European Space Agency (ESA) Exomars mission 2020 is assembled and tested for the mission purpose and requirements. Two different processes were tried for the laser assembling: one based on adhesives, following traditional laser manufacturing processes; another based on a low-stress and organic-free soldering technique called solderjet bumping technology. The manufactured devices were tested for the processes validation by passing mechanical, thermal cycles, radiation, and optical functional tests. The comparison analysis showed a device improvement in terms of reliability of the optical performances from the soldered to the assembled by adhesive-based means