Plasma‐polymerized hexamethyldisiloxane (pp‐HMDSO) thin films have been deposited in a radiofrequency (RF) remote plasma‐enhanced chemical vapor deposition (PECVD) system, on different types of substrates: silicon wafers, glass, quartz crystals, and chemiresistor structure. The as‐grown thin films have been post treated in two types of reactive plasmas produced in SF6 and O2 gases. The effect of this surface modification on different properties of the as‐grown pp‐HMDSO thin film (chemical structure, elemental composition, surface morphology, film density and thickness, optical bandgap, and electrical resistivity) has been investigated. It is found that SF6 plasma and O2 plasma surface modifications of the as‐grown pp‐HMDSO thin film induce property changes different from each other. SF6 plasma converted the as‐grown pp‐HMDSO film to a more porous material and caused a narrowing of its optical band gap of about 33%, while O2 plasma induced a lowering of film electrical resistivity of about two orders of magnitude.
We investigate micro-roughness of silicon surface in remote radiofrequency (RF) SF 6 plasma, for different etching durations. A linear behavior of etching rate is observed as a function of etching time. PL measurements at different temperatures indicate a visible (green and violet) and ultraviolet (UV) emissions. The evolution of surface roughness of Si substrates can be controlled depending on the etching duration.In response to the increase of the etching duration, the surface undergoes nanoscale roughening, ripple formation, and finally microscale roughening. Atomic force microscopy analysis was carried out to surface morphology.
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