Because of their low height, the low assembly topography and their mechanical flexibility, ultra thin chips (about 20 µm) offer a wide field of possible applications. During the last years, we have successfully investigated in production, handling and assembly processes for such thin ICs. The chip handling and assembly processes had to be adapted to the very thin material, beginning with the development of special “Dicing by Thinning” process. A new pick and place process using thermal releasable tapes has been developed. For the chip assembly and contacting various methods depending on the application are available. The complete process chain from wafer processing up to the assembled ultra thin IC together with some application examples is discussed
We present a new epoxy-based negative-tone dry film photoresist (DFR) for fabricating multilayer microfluidic devices using a lamination process combined with a standard photolithography technology. As proof-of-concept, a complex 3D-hydrodynamic focusing device was produced via a six-layer lamination process of 33 µm-thick DFR layers. The bonding strength of the new DFR was tested on silicon, glass, and titanium substrates, respectively. A maximum bonding strength of 37 MPa was obtained for the dry film photoresist laminated on glass. No leakage was found, and burst tests proved excellent robustness and sealing reliability of the microchannels
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