Galvanoplated 3D structures for micro systems

Löchel, Bernd; Maciossek, A.; König, M.; Quenzer, Hans-Joachim; Huber, H.-L.

doi:10.1016/0167-9317(94)90194-5

Cited by 39 publications

(17 citation statements)

References 1 publication

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“…3 In this case the resist baking had to be done in a single step for the entire layer. Different strategies for generating very thick photoresist layers were tried.…”

Section: Methodsmentioning

confidence: 99%

“…3 UV shadow printers with a wavelength range of 350-450 nm were used for patterning. Defects caused by contact lithography were mostly negligible because of the relatively large structure size in microsystem technology.…”

Section: Methodsmentioning

confidence: 99%

“…[1][2][3][4][5][6][7][8] Patterning of resist layers up to 200 m using ultraviolet ͑UV͒ light and contact printing was reported. For many years the development has focused on high resolution and high printing accuracy.…”

Section: Introductionmentioning

confidence: 99%

See 2 more Smart Citations

Application of ultraviolet depth lithography for surface micromachining

Loechel

Maciossek

Rothe

1995

Journal of Vacuum Science &Amp; Technology B: Microelectronics and Nanometer Structures Processing, Measurement, and Phenomena

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Very thick photoresist layers were patterned by contact ultraviolet ͑UV͒ lithography. In a following microelectrodeposition step the generated resist patterns were molded and three-dimensional ͑3D͒ microstructures were fabricated directly onto system surfaces. The new technology, called 3D UV-microforming, consists of an advanced resist preparation process, an UV lithographic step, resist development, a molding procedure by electrodeposition, and finally stripping and cleaning for finishing the structures. It enables the low-cost fabrication of a wide variety of microcomponents for many different uses. During resist preparation, layers up to 200 m thickness were obtained. By using a standard UV mask aligner as an exposure tool followed by immersion development, thick resist layers up to 100 m could be patterned in a single step on preprocessed silicon wafers. Repeated exposure and development were successfully used for structuring resist layers of up to 200 m thickness. Using AZ 4000 series photoresist, the resolution is also limited by mechanical stability. For lines and spaces in 15-m-thick resist a minimum width of 3 m for the resist was found to be necessary to overcome the fabrication process. For thicker layers high aspect ratios of more than 10 as well as steep edges of more than 88°could be fabricated. The resist patterns used were molded by pulse or by direct current electroplating. For microsystem applications some metals and alloys were deposited. Three-dimensional microcomponents were fabricated as samples for demonstrating the new technique. The technique allows the use of materials with interesting properties, ones that could not be provided by standard processes.

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“…3 In this case the resist baking had to be done in a single step for the entire layer. Different strategies for generating very thick photoresist layers were tried.…”

Section: Methodsmentioning

confidence: 99%

Section: Methodsmentioning

confidence: 99%

See 1 more Smart Citation

Application of ultraviolet depth lithography for surface micromachining

Loechel

Maciossek

Rothe

1995

Journal of Vacuum Science &Amp; Technology B: Microelectronics and Nanometer Structures Processing, Measurement, and Phenomena

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“…Different types of metallic, dielectric and polymer layers are used as sacrificial layers. In many MEMS processes, metallic as well as non-metallic/dielectric sacrificial layers such as copper, aluminum, titanium, chromium [2][3][4][5][6], various forms of silicon and its oxides [7,8,11], phosphoric glass [9], borophosphosilicate glass (BPSG) [10], porous silicon etc. [11] are used.…”

Section: Introductionmentioning

confidence: 99%

Optimization of poly (methyl methacrylate) as sacrificial layer for application in low temperature MEMS

Kshirsagar

Duttagupta

Gangal

2012

2012 1st International Symposium on Physics and Technology of Sensors (ISPTS-1)

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The recent development in smart systems can benefit from the integration of MEMS and CMOS technology with emphasis on low temperature processing that utilizes low cost substrates. The main constraints in MEMS/IC process are high thermal budget and harsh chemical usage in the processing. Polymers are generally used in surface micromachining as sacrificial layers, but face a problem of high temperature (150-250°C) baking cycles and the cost associated with it. This paper reports an in-house preparation (optimized formulation) and optimization of PMMA solution with a view to solve the problem with high temperature processing. Surface micromachined silicon nitride cantilevers using PMMA as sacrificial layer is fabricated to prove its feasibility for low temperature MEMS applications.

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“…Both UV lithography and electrodeposition do not require any expensive or unchecked new equipment. 13 New strategies for the resist coating like electrophoresis were applied to cover inclined surfaces homogeneously with the resist 15 for the following lithographic patterning. Being used in the back-end for microsystem fabrication, it has extended the available material options, offering completely new design possibilities.…”

Section: Introductionmentioning

confidence: 99%

Application of optical lithography for high aspect ratio microstructures

Loechel

Demmeler

Rothe

et al. 1996

Journal of Vacuum Science &Amp; Technology B: Microelectronics and Nanometer Structures Processing, Measurement, and Phenomena

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Articles you may be interested inAg2Te/As2S3: A high-contrast, top-surface imaging resist for 193 nm lithography J.Interest in thick photoresist applications is steadily growing. Besides the bump fabrication and wire interconnect technology, the process of patterning thick layer photoresists by UV lithography is specially qualified for applications in micro electro mechanical systems. Specialized equipment and new photoresists have been developed or are under development to cope with the new challenges in the field of preparing extremely thick photoresist layers, to plan the process of patterning these thick resists, and to deal with the difficulties of the following galvanoplating step. A technology called three-dimensional ͑3D͒ UV-microforming was developed, consisting of a resist preparation process for very thick photoresists ͑positive or negative tone͒, UV lithographic steps, resist development, moulding procedures by galvanodeposition, and finally stripping and cleaning for finishing the structures. A minimum width of 3 m for the resist bars was found to be necessary to withstand the fabrication process of lines and spaces in 15 m thick resist. For thicker layers high aspect ratios of more than 10 as well as steep edges of more than 88°could be fabricated. The resist patterns were moulded by using electroplating. For microsystem applications metals and alloys can be deposited into the resist patterns. 3D UV-microforming, a combination of UV patterning of thick layer resists and galvanoplating, enables the low-cost fabrication of a wide variety of micro components for many different users.

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Galvanoplated 3D structures for micro systems

Cited by 39 publications

References 1 publication

Application of ultraviolet depth lithography for surface micromachining

Application of ultraviolet depth lithography for surface micromachining

Optimization of poly (methyl methacrylate) as sacrificial layer for application in low temperature MEMS

Application of optical lithography for high aspect ratio microstructures

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