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encoder and a frequency shift keying (FSK) RF transmitter. Many of the system blocks are from preRecent years have seen the rapid development of existing libraries, or have been written and imported in an microsensor technology, system on chip design, wireless intellectual property (IP) block form, thus the design technology and ubiquitous computing. When assembled represents the first steps towards a sensor system-on-chip.into a complex microsystem the technologies become SENSOR SYSTEM ON CHIP powerful tools in medical diagnostics, environmental monitoring and personal connectivity. In this paper we Figure 1 shows the schematic of the SOC. The design describe the demonstration of a silicon chip that has all flow used to create the SOC was relatively the attributes required of a microsystem for use in these straightforward.Cadence tools were used for applications. The design methodology we have employed analogue/digital simulations and back-end design tasks is a variant of the system on chip approach whereby and Synopsys tools were used for digital synthesis of many intellectual property blocks are integrated at a high VHDL behavioural and register transfer level level in the design flow. Our intellectual property blocks descriptions. Transistor-level or gate-level simulations include the analogue sensor instrumentation for were used to verify that all functional blocks worked as temperature and pH, a data multiplexing and conversion desired before chip assembly and implementation. The module, a digital platform based around an 8-bit micromicro-controller block, including the hardware controller, data encoding for spread-spectrum wireless architecture and the software routines, was verifled by transmission and a RF section requiring very few off-chip writing to a XILINX SPARTANII-FPGA followed by components. The chip has been fully evaluated and board-level testing to ensure proper functionality before tested by connection to external sensors. Each block has committing to silicon. well defined interfaces so that they can be easily reused Sensor interfaces in future designs targeted to different applications.The system operates with pH (acidity/alkalinity) and

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Thermal and electrical transport in FinFET with statistical variations is investigated by 3D coupled electro-thermal simulation, using statistical-variabilityaware device simulator GARAND with built-in thermal simulation module. The module employs a new formula for the calculation of the thermal conductivity in the fin region with fin shape dependence. An SOI FinFET structure with combined statistical sources of GER, FER and MGG is studied, with a focus on the lattice temperature profile and the statistical distribution of on current.

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