CuSO~oSH20--20 g/100 ml H20; plating time, 5 min ml of HF added 0.5 1.0 1.5 2.0 Bond strength Did not 718 (held) 404 610 in grams solder 718 (held) 718 (held) 404 718 (held) 718 (held) 290 718 404 404 Average --718 561 427 Table III. Plating time--varied CuSO4o5H20--20 g/100 ml H~O; HF added, 1 ml Plating time in rain 4 5 6 Bond strength Did not 718 (held) 404 in grams solder 718 (held) 404 718 (held) 404 718 404
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