This paper describes various measurem performed on Intel's 22nm process technology reliability implications. Comparisons to thermal and analytical data show excellent matching.I.
Intel Corporation a-CH5-157 / b-CH5-148 5000, W. Chandler Blvd. Chandler, AZ Peripheral array BGA with 800x800 mils die on a 42.5x42.5 mm OLGA 'I7] package mounted on FR4 substrate. Peripheral array BGA with 717x604 mils die on a 42.5x42.5 mm OLGA [I7] package mounted on FR4 substrate. Full grid array BGA with 400x400 mil die on a 32x32 mm OLGA "' I package mounted on FR4 substrate. Full grid array BGA with 800x800 mils die on a 42.5x42.5 mm OLGA [17] package mounted on FR4 substrate.Abstract agreement explaining the crack location, propagation and Ball Grid Array (BGA) is currently the interconnect of crack lengths. choice for attaching microprocessors on a printed circuit Based on this data, the effect of package design board (PCB). The reliability of solder joints is one of the parameters on the propensity of BGA fatigue failure are critical issues in BGA surface mount technology (SMT). predicted, and recommendations are made for future package During reliability testing, BGA fatigue failures were designs. Furthermore, the identified maximum damage observed on test vehicles (TV). Finite element analysis and accumulation locations for different BGA patterns provides physical failure analysis were used to determine the risk to the product in the field. As part of this effort, parametric finite element analysis was carried out to determine the effect of design features like the package size, and BGA pattern on the propensity of fatigue failure. The results of the finite element analysis and physical failure analysis showed that the risk to fatigue failure was much greater on a peripheral / partial grid array package than in a full grid array package.
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